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參數(shù)資料
| 型號： | TEA1620P |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | STARplug |
| 中文描述： | 0.25 A SWITCHING REGULATOR, 200 kHz SWITCHING FREQ-MAX, PDIP8 |
| 封裝： | 0.300 INCH, PLASTIC, MO-001, DIP-8 |
| 文件頁數(shù)： | 13/16頁 |
| 文件大?。?/td> | 84K |
| 代理商： | TEA1620P |
9397 750 12577
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 01 — 17 March 2004
13 of 16
Philips Semiconductors
TEA1620P
STARplug
TM
15. Soldering
15.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
15.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250
°
C or 265
°
C, depending on solder material applied, SnPb or
Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
15.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300
°
C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 and 400
°
C, contact may be up to 5 seconds.
15.4 Package related soldering information
[1]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2]
For PMFP packages hot bar soldering or manual soldering is suitable.
Table 7:
Suitability of through-hole mount IC packages for dipping and wave soldering
methods
Soldering method
Dipping
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable
PMFP
[2]
Package
Wave
suitable
[1]
not suitable
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TEA1620P/N1,112 | 功能描述:開關(guān)變換器、穩(wěn)壓器與控制器 STARPLUG SMPS CNTRLR 48 OHM RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開關(guān)頻率:1 MHz 工作溫度范圍: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel |
| TEA1622P | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:STARplugTM |
| TEA1622P/N1 | 功能描述:轉(zhuǎn)換 - 電壓電平 STARPLUG RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| TEA1622P/N1,112 | 功能描述:轉(zhuǎn)換 - 電壓電平 STARPLUG RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| TEA1623 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:TEA1623 |
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