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參數(shù)資料
| 型號： | TEA1654T |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | GreenChipII SMPS control IC |
| 中文描述： | SWITCHING CONTROLLER, 75 kHz SWITCHING FREQ-MAX, PDSO14 |
| 封裝： | 3.90 MM, PLASTIC, SO-14 |
| 文件頁數(shù)： | 19/24頁 |
| 文件大?。?/td> | 119K |
| 代理商： | TEA1654T |
2003 May 12
19
Philips Semiconductors
Product specification
GreenChip
II SMPS control IC
TEA1654
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
not suitable
not suitable
(3)
suitable
suitable
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
suitable
suitable
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參數(shù)描述 |
|---|---|
| TEA1654T,118 | 功能描述:交流/直流開關(guān)轉(zhuǎn)換器 SW Mode Power Supply Controller 14-Pin RoHS:否 制造商:STMicroelectronics 輸出電壓:800 V 輸入/電源電壓（最大值）:23.5 V 輸入/電源電壓（最小值）:11.5 V 開關(guān)頻率:115 kHz 電源電流:1.6 mA 工作溫度范圍:- 40 C to + 150 C 安裝風格:SMD/SMT 封裝 / 箱體:SSO-10 封裝:Reel |
| TEA1654T/N1,518 | 功能描述:轉(zhuǎn)換 - 電壓電平 TEA1654T/SO14/REEL13DP//N1 RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MLF-8 |
| TEA1655T/N1,518 | 功能描述:交流/直流開關(guān)轉(zhuǎn)換器 IC CTLR SMPS SW MODE RoHS:否 制造商:STMicroelectronics 輸出電壓:800 V 輸入/電源電壓（最大值）:23.5 V 輸入/電源電壓（最小值）:11.5 V 開關(guān)頻率:115 kHz 電源電流:1.6 mA 工作溫度范圍:- 40 C to + 150 C 安裝風格:SMD/SMT 封裝 / 箱體:SSO-10 封裝:Reel |
| TEA1656T/N1,118 | 功能描述:開關(guān)變換器、穩(wěn)壓器與控制器 TEA1656T/SO8/REEL13/ RoHS:否 制造商:Texas Instruments 輸出電壓:1.2 V to 10 V 輸出電流:300 mA 輸出功率: 輸入電壓:3 V to 17 V 開關(guān)頻率:1 MHz 工作溫度范圍: 安裝風格:SMD/SMT 封裝 / 箱體:WSON-8 封裝:Reel |
| TEA1657T/N1,518 | 功能描述:交流/直流開關(guān)轉(zhuǎn)換器 IC CTLR RESONANT CONV RoHS:否 制造商:STMicroelectronics 輸出電壓:800 V 輸入/電源電壓（最大值）:23.5 V 輸入/電源電壓（最小值）:11.5 V 開關(guān)頻率:115 kHz 電源電流:1.6 mA 工作溫度范圍:- 40 C to + 150 C 安裝風格:SMD/SMT 封裝 / 箱體:SSO-10 封裝:Reel |
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