1. 參數(shù)資料
    型號: TEA5591A
    廠商: NXP SEMICONDUCTORS
    元件分類: 接收器
    英文描述: AM/FM radio receiver circuit
    中文描述: AM/FM, AUDIO SINGLE CHIP RECEIVER, PDIP24
    封裝: 0.400 INCH, SHRINK, PLASTIC, SOT-234-1, DIP-24
    文件頁數(shù): 14/14頁
    文件大?。?/td> 144K
    代理商: TEA5591A
    February 1990
    14
    Philips Semiconductors
    Product specification
    AM/FM radio receiver circuit
    TEA5591A
    SOLDERING
    Introduction
    There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
    surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
    surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
    used.
    This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
    “IC Package Databook”(order code 9398 652 90011).
    Soldering by dipping or by wave
    The maximum permissible temperature of the solder is 260
    °
    C; solder at this temperature must not be in contact with the
    joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
    The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
    specified maximum storage temperature (T
    stg max
    ). If the printed-circuit board has been pre-heated, forced cooling may
    be necessary immediately after soldering to keep the temperature within the permissible limit.
    Repairing soldered joints
    Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
    than 2 mm above it. If the temperature of the soldering iron bit is less than 300
    °
    C it may remain in contact for up to
    10 seconds. If the bit temperature is between 300 and 400
    °
    C, contact may be up to 5 seconds.
    DEFINITIONS
    LIFE SUPPORT APPLICATIONS
    These products are not designed for use in life support appliances, devices, or systems where malfunction of these
    products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
    use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
    improper use or sale.
    Data sheet status
    Objective specification
    Preliminary specification
    Product specification
    This data sheet contains target or goal specifications for product development.
    This data sheet contains preliminary data; supplementary data may be published later.
    This data sheet contains final product specifications.
    Limiting values
    Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
    more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
    of the device at these or at any other conditions above those given in the Characteristics sections of the specification
    is not implied. Exposure to limiting values for extended periods may affect device reliability.
    Application information
    Where application information is given, it is advisory and does not form part of the specification.
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