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參數(shù)資料
| 型號： | TEA6886 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Up-level Car radio Analog Signal Processor CASP |
| 中文描述： | 截至級車電臺模擬信號處理器支持核心計劃 |
| 文件頁數(shù)： | 87/92頁 |
| 文件大小： | 376K |
| 代理商： | TEA6886 |
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2000 Nov 21
87
Philips Semiconductors
Product specification
Up-level Car radio Analog Signal
Processor (CASP)
TEA6886HL
15.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| TEA6886HL | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Up-level Car radio Analog Signal Processor CASP |
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| TEA6R8M1JBK-0613P | 功能描述:鋁質(zhì)電解電容器 - 帶引線 63V 6.8uF 20% RoHS:否 制造商:Kemet 引線類型: 電容:220 uF 容差:20 % 電壓額定值:25 V 工作溫度范圍: 端接類型:Radial 外殼直徑:8 mm 外殼長度:11 mm 引線間隔:5 mm 產(chǎn)品:General Purpose Electrolytic Capacitors 封裝:Bulk |
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