參數(shù)資料
型號(hào)： TEA6886HL
廠商： NXP SEMICONDUCTORS
元件分類： 消費(fèi)家電
英文描述： Up-level Car radio Analog Signal Processor CASP
中文描述： SPECIALTY CONSUMER CIRCUIT, PQFP80
封裝： 12 X 12 MM, 1.40 MM HEIGHT, PLASTIC, SOT-315-1, LQFP-80
文件頁(yè)數(shù)： 2/92頁(yè)
文件大?。?/td> 376K
代理商： TEA6886HL
2000 Nov 21
2
Philips Semiconductors
Product specification
Up-level Car radio Analog Signal
Processor (CASP)
TEA6886HL
CONTENTS
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
7.1
7.2
7.3
7.4
FEATURES
General
Stereo decoder and noise blanking
Weak signal processing
Audio pre-amplifier
GENERAL DESCRIPTION
ORDERING INFORMATION
QUICK REFERENCE DATA
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Stereo decoder
FM noise blanker
AM noise blanker
Multipath/fading detection and weak signal
control
Tone/volume control
Source selector
Loudness
Volume 1
Treble
Bass
Volume 2
RSA selector
Chime adder
LIMITING VALUES
THERMAL CHARACTERISTICS
CHARACTERISTICS
I
2
C-BUS PROTOCOL
7.5
7.5.1
7.5.2
7.5.3
7.5.4
7.5.5
7.5.6
7.5.7
7.5.8
8
9
10
11
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
11.10
11.11
11.12
11.13
11.14
11.15
11.16
12
13
14
15
15.1
Read mode: 1st data byte
Read mode: 2nd data byte
Subaddress byte for write
Write mode: subaddress 0H
Write mode: subaddress 1H
Write mode: subaddress 2H
Write mode: subaddress 3H
Write mode: subaddress 4H
Write mode: subaddress 5H
Write mode: subaddress 6H
Write mode: subaddress 7H
Write mode: subaddress 8H
Write mode: subaddress 9H
Write mode: subaddress AH
Write mode: subaddress BH
Write mode: subaddress CH
INTERNAL CIRCUITRY
TEST CIRCUIT
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
2
C COMPONENTS
15.2
15.3
15.4
15.5
16
17
18
19
相關(guān)PDF資料
PDF描述
TEA8172 TV Vertical Deflection Output Amplifier
TES225ZG-A Very High Efficiency
TES150YE-A Very High Efficiency
TES150ZE-A Very High Efficiency
TES113YD-A Very High Efficiency
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TEA6886HL/V2,518 功能描述:IC CAR RADIO ASP 80-LQFP RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻處理 系列:- 其它有關(guān)文件:STA321 View All Specifications 標(biāo)準(zhǔn)包裝:1 系列:Sound Terminal™ 類型:音頻處理器 應(yīng)用:數(shù)字音頻 安裝類型:表面貼裝 封裝/外殼:64-LQFP 裸露焊盤 供應(yīng)商設(shè)備封裝:64-LQFP EP（10x10） 包裝:Digi-Reel® 其它名稱:497-11050-6
TEA6R8M1HBK-0512P 功能描述:鋁質(zhì)電解電容器 - 帶引線 50V 6.8uF 20% RoHS:否 制造商:Kemet 引線類型: 電容:220 uF 容差:20 % 電壓額定值:25 V 工作溫度范圍: 端接類型:Radial 外殼直徑:8 mm 外殼長(zhǎng)度:11 mm 引線間隔:5 mm 產(chǎn)品:General Purpose Electrolytic Capacitors 封裝:Bulk
TEA6R8M1HTR-0512P 功能描述:鋁質(zhì)電解電容器 - 帶引線 50VOLT 6.8uF 20% RoHS:否 制造商:Kemet 引線類型: 電容:220 uF 容差:20 % 電壓額定值:25 V 工作溫度范圍: 端接類型:Radial 外殼直徑:8 mm 外殼長(zhǎng)度:11 mm 引線間隔:5 mm 產(chǎn)品:General Purpose Electrolytic Capacitors 封裝:Bulk
TEA6R8M1JBK-0613P 功能描述:鋁質(zhì)電解電容器 - 帶引線 63V 6.8uF 20% RoHS:否 制造商:Kemet 引線類型: 電容:220 uF 容差:20 % 電壓額定值:25 V 工作溫度范圍: 端接類型:Radial 外殼直徑:8 mm 外殼長(zhǎng)度:11 mm 引線間隔:5 mm 產(chǎn)品:General Purpose Electrolytic Capacitors 封裝:Bulk
TEA7000 制造商:STMicroelectronics 功能描述:PHILIPS ENSATION PRODCUT FOR WIRELESS AUDIO APLLICATION - Bulk
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*