參數(shù)資料
型號: TFA9842J
廠商: NXP SEMICONDUCTORS
元件分類: 音頻/視頻放大
英文描述: 2-channel audio amplifier; SE: 1 W to 7.5 W; BTL: 2 W to 15 W
中文描述: 7.5 W, 2 CHANNEL, AUDIO AMPLIFIER, PZFM9
封裝: PLASTIC, SOT-523-1, DIL-BENT-SIL, 9 PIN
文件頁數(shù): 21/21頁
文件大?。?/td> 143K
代理商: TFA9842J
Koninklijke Philips Electronics N.V. 2004.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 26 April 2004
Document order number: 9397 750 12013
Contents
Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.2.1
8.2.2
8.3
8.4
8.5
9
10
11
12
13
13.1
13.1.1
13.1.2
13.2
14
14.1
15
16
16.1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 4
Input configuration . . . . . . . . . . . . . . . . . . . . . . 4
Power amplifier. . . . . . . . . . . . . . . . . . . . . . . . . 4
Output power measurement . . . . . . . . . . . . . . . 5
Headroom. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5
Supply voltage ripple rejection . . . . . . . . . . . . . 6
Built-in protection circuits . . . . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal characteristics. . . . . . . . . . . . . . . . . . . 7
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Application information. . . . . . . . . . . . . . . . . . 13
Printed-circuit board . . . . . . . . . . . . . . . . . . . . 14
Layout and grounding. . . . . . . . . . . . . . . . . . . 14
Power supply decoupling . . . . . . . . . . . . . . . . 15
Thermal behavior and heatsink calculation . . 15
Test information. . . . . . . . . . . . . . . . . . . . . . . . 16
Quality information . . . . . . . . . . . . . . . . . . . . . 16
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Introduction to soldering through-hole
mount packages . . . . . . . . . . . . . . . . . . . . . . 18
Soldering by dipping or by solder wave . . . . . 18
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 18
Package related soldering information . . . . . . 18
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19
Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 20
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
16.2
16.3
16.4
17
18
19
20
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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