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參數(shù)資料
| 型號： | TGA4046 |
| 廠商： | TRIQUINT SEMICONDUCTOR INC |
| 元件分類： | 衰減器 |
| 英文描述： | 2W Q-Band High Power Amplifier |
| 中文描述： | 41000 MHz - 46000 MHz RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER |
| 封裝： | 0.136 X 0.173 INCH, 0.004 INCH HEIGHT, ROHS COMPLIANT, DIE-10 |
| 文件頁數(shù)： | 6/9頁 |
| 文件大?。?/td> | 129K |
| 代理商： | TGA4046 |
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
February 10, 2006
TGA4046
6
Mechanical Drawing
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
1
2
3
4
5
6
7
8
9
10
0
0
0.443
(0.017)
0.868
(0.034)
2.062
(0.081)
3.300
(0.130)
3.446
(0.136)
0.105
(0.004)
2.575
(0.101)
2.390
4.281
(0.169)
3.349
(0.130)
4.386
(0.173)
1.811
(0.071)
1.626
0.095
(0.004)
0.443
(0.017)
0.868
(0.034)
2.062
(0.081)
3.300
(0.130)
Units: millimeters (inches)
Thickness: 0.100 (0.004)
Chip edge to bond pad dimensions are shown to center of bond pad
Chip size tolerance: +/- 0.051 (0.002)
GND is back side of MMIC
Bond pad #1:
Bond pad #2, #4, #8, #10:
Bond pad #3, #9:
Bond pad #5, #7:
Bond pad #6:
(RF In)
(Vg)
(Vd)
(Vd)
(RF Out)
0.114 x 0.200 (0.004 x 0.008)
0.100 x 0.100 (0.004 x 0.004)
0.150 x 0.100 (0.006 x 0.004)
0.200 x 0.120 (0.008 x 0.005)
0.105 x 0.200 (0.004 x 0.008)
1.997
2.771
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