參數(shù)資料
型號(hào): TGA4506-SM
廠商: TRIQUINT SEMICONDUCTOR INC
元件分類: 衰減器
英文描述: K Band Packaged Low Noise Amplifier
中文描述: 21000 MHz - 27000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
封裝: 0.157 X 0.157 INCH, 0.043 INCH HEIGHT, ROHS COMPLIANT, QFN-20
文件頁數(shù): 10/10頁
文件大?。?/td> 123K
代理商: TGA4506-SM
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
November 14, 2005
10
Recommended Surface Mount Package Assembly
Proper ESD precautions must be followed while handling packages.
Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven
vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed
in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement.
The volume of solder paste depends on PCB and component layout and should be well controlled to
ensure consistent mechanical and electrical performance.
Clean the assembly with alcohol.
Typical Solder Reflow Profiles
Reflow Profile
SnPb
Pb Free
Ramp-up Rate
3
°
C/sec
3
°
C/sec
Activation Time and
Temperature
60 – 120 sec @ 140 – 160
°
C
60 – 180 sec @ 150 – 200
°
C
Time above Melting Point
60 – 150 sec
60 – 150 sec
Max Peak Temperature
240
°
C
260
°
C
Time within 5
°
C of Peak
Temperature
10 – 20 sec
10 – 20 sec
Ramp-down Rate
4 – 6
°
C/sec
4 – 6
°
C/sec
相關(guān)PDF資料
PDF描述
TGA4506 K Band Low Noise Amplifier
TGA4507-EPU Ka Band Low Noise Amplifier
TGA4508 Ka Band Low Noise Amplifier
TGA4509-EPU 27 - 31 GHz 1W Power Amplifier
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