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參數(shù)資料
| 型號： | TGA4816-EPU |
| 廠商： | TRIQUINT SEMICONDUCTOR INC |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | 10Gb/s Differential TIA |
| 中文描述： | SPECIALTY TELECOM CIRCUIT, UUC6 |
| 封裝： | DIE-6 |
| 文件頁數(shù)： | 7/7頁 |
| 文件大?。?/td> | 113K |
| 代理商： | TGA4816-EPU |
TriQuint Semiconductor Texas Phone : (972)994-8465 Fax: (972)994-8504 Web: www.triquint.com
Advance Product Information
November 16, 2004
7
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Reflow process assembly notes:
Use AuSn (80/20) solder with limited exposure to temperatures at or above 300
°
C.
(30 seconds maximum)
An alloy station or conveyor furnace with reducing atmosphere should be used.
No fluxes should be utilized.
Coefficient of thermal expansion matching is critical for long-term reliability.
Devices must be stored in a dry nitrogen atmosphere.
Component placement and adhesive attachment assembly notes:
Vacuum pencils and/or vacuum collets are the preferred method of pick up.
Air bridges must be avoided during placement.
The force impact is critical during auto placement.
Organic attachment can be used in low-power applications.
Curing should be done in a convection oven; proper exhaust is a safety concern.
Microwave or radiant curing should not be used because of differential heating.
Coefficient of thermal expansion matching is critical.
Interconnect process assembly notes:
Thermosonic ball bonding is the preferred interconnect technique.
Force, time, and ultrasonics are critical parameters.
Aluminum wire should not be used.
Maximum stage temperature is 200
°
C.
Assembly Process Notes
TGA4816-EPU
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TGA4817-EPU | 10Gb/s Wide Dynamic Range Differential TIA |
| TGA4819-SL | 10.7Gb/s Linear Optical Modulator Driver |
| TGA4823-SM | 9.9 - 12.5 Gb/s Linear/Limiting Optical Modulator Driver |
| TGA4830-EPU | Wideband Low Noise Amplifier |
| TGA4832 | DC - 35 GHz Wideband Amplifier |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TGA4817 | 功能描述:射頻放大器 10.7 GB/s Diff TIA 3.2k dB Ohms RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| TGA4817-EPU | 制造商:TRIQUINT 制造商全稱:TriQuint Semiconductor 功能描述:10Gb/s Wide Dynamic Range Differential TIA |
| TGA4819-SL | 功能描述:緩沖器和線路驅(qū)動器 10.7 GB/s Linear Optical Driver RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| TGA4823-2-SM | 功能描述:線性穩(wěn)壓器 - 標準 10Gb/s Linear Limit Dvr Amp RoHS:否 制造商:STMicroelectronics 輸出類型: 極性: 輸出電壓:1.8 V 輸出電流:150 mA 負載調(diào)節(jié): 最大輸入電壓:5.5 V 線路調(diào)整率: 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOT-323-5L |
| TGA4823-SM | 功能描述:線性穩(wěn)壓器 - 標準 10Gb/s Linear Limit Dvr Amp RoHS:否 制造商:STMicroelectronics 輸出類型: 極性: 輸出電壓:1.8 V 輸出電流:150 mA 負載調(diào)節(jié): 最大輸入電壓:5.5 V 線路調(diào)整率: 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOT-323-5L |
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