參數(shù)資料
型號: TGA4823-SM
廠商: TRIQUINT SEMICONDUCTOR INC
元件分類: 光調(diào)制
英文描述: 9.9 - 12.5 Gb/s Linear/Limiting Optical Modulator Driver
中文描述: FIBER OPTIC MODULATOR-MACH ZEHNDER, 12500Mbps, SURFACE MOUNT
封裝: 8 X 8 MM, 2.10 MM HEIGHT, ROHS COMPLIANT, SMD-28
文件頁數(shù): 16/16頁
文件大?。?/td> 984K
代理商: TGA4823-SM
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
16
TGA4823-SM
Aug 2007 Rev -
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Assembly Notes
Ordering Information
Recommended Surface Mount Package Assembly
Proper ESD precautions must be followed while handling packages.
Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow
oven vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles
are listed in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot
placement. The volume of solder paste depends on PCB and component layout and should be well
controlled to ensure consistent mechanical and electrical performance.
Clean the assembly with alcohol.
4 – 6
°
C/sec
4 – 6
°
C/sec
Ramp-down Rate
10 – 20 sec
10 – 20 sec
Time within 5
°
C of Peak Temperature
260
°
C
240
°
C
Max Peak Temperature
60 – 150 sec
60 – 150 sec
Time above Melting Point
60 – 180 sec @ 150 – 200
°
C
60 – 120 sec @ 140 – 160
°
C
Activation Time and Temperature
3
°
C/sec
3
°
C/sec
Ramp-up Rate
Pb Free
SnPb
Reflow Profile
Typical Solder Reflow Profiles
8x8 Surface Mount
TGA4823-SM
Package Style
Part
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