參數(shù)資料
型號: TGA8300-SCC
廠商: TRIQUINT SEMICONDUCTOR INC
元件分類: 衰減器
英文描述: Gain Block Amplifier
中文描述: 2 MHz - 18000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
封裝: CHIP
文件頁數(shù): 7/7頁
文件大?。?/td> 176K
代理商: TGA8300-SCC
7
TGA8300-SCC
MECHANICAL DRAWING
0,3073
(0.0121)
1,1227
(0.0442)
1,4199
(0.0559)
0,1803
(0.0071)
1,6256
(0.0640)
0
0
0,1524
(0.0060)
2,2047
(0.0868)
2,3622
(0.0930)
2,2073
(0.0869)
0,1702
(0.0067)
1
2
3
4
Units: millimeters (inches)
Thickness: 0,1524 (0.0060) (reference only)
Chip edge to bond pad dimensions are shown to center of bond pad.
Chip size tolerance: ± 0,0508 (0.0020)
Bond pad #1 (RF Input):
Bond pad #2 (V
+
):
Bond pad #3 (RF Output):
Bond pad #4 (V
):
0,1270 x 0,1016 (0.0050 x 0.0040)
0,1575 x 0,1245 (0.0062 x 0.0049)
0,1321 x 0,1016 (0.0052 x 0.0040)
0,0635 (0.0025) (radius)
TriQuint Semiconductor, Inc.
Texas Facilities
(972) 995-8465
www.triquint.com
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