參數(shù)資料
型號(hào): TGA8344-SCC
廠商: TRIQUINT SEMICONDUCTOR INC
元件分類: 衰減器
英文描述: 2 - 18 GHz Low Noise Amplifier
中文描述: 2000 MHz - 18000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
封裝: 3.99 X 3.81 MM, 0.10 MM HEIGHT, CHIP
文件頁(yè)數(shù): 7/11頁(yè)
文件大小: 506K
代理商: TGA8344-SCC
Product Data Sheet
TGA8344-SCC
7
TriQuint Semiconductor Texas Phone: (972)994 8465 Fax: (972)994 8504 Web: www.triquint.com
Table IV
AUTOPROBE FET PARAMETER MEASUREMENT CONDITIONS
FET Parameters
Test Conditions
I
DSS
:
Maximum drain current (I
DS
) with gate voltage
(V
GS
) at zero volts.
V
GS
= 0.0 V, drain voltage (V
DS
) is swept from 0.5 V
up to a maximum of 3.5 V in search of the maximum
value of I
DS
; voltage for I
DSS
is recorded as VDSP.
For all material types, V
DS
is swept between 0.5 V
and VDSP in search of the maximum value of I
ds
.
This maximum I
DS
is recorded as IDS1. For
Intermediate and Power material, IDS1 is measured
at V
GS
= VG1 = -0.5 V. For Low Noise, HFET and
pHEMT material, V
GS
= VG1 = -0.25 V. For
LNBECOLC, use V
GS
= VG1 = -0.10 V.
V
DS
fixed at 2.0 V, V
GS
is swept to bring I
DS
to
0.5 mA/mm.
G
m
:
Transconductance;
I
DSS
IDS1
(
VG1
)
V
P
:
Pinch-Off Voltage; V
GS
for I
DS
= 0.5 mA/mm of
gate width.
V
BVGD
:
Breakdown Voltage, Gate-to-Drain; gate-to-
drain breakdown current (I
BD
) = 1.0 mA/mm
of gate width.
Drain fixed at ground, source not connected
(floating), 1.0 mA/mm forced into gate, gate-to-drain
voltage (V
GD
) measured is V
BDGD
and recorded as
BVGD; this cannot be measured if there are other
DC connections between gate-drain, gate-source or
drain-source.
V
BVGS
:
Breakdown Voltage, Gate-to-Source; gate-to-
source breakdown current (I
BS
) = 1.0 mA/mm
of gate width.
Source fixed at ground, drain not connected
(floating), 1.0 mA/mm forced into gate, gate-to-
source voltage (V
GS
) measured is V
BDGS
and recorded
as BVGS; this cannot be measured if there are other
DC connections between gate-drain, gate-source or
drain-source.
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