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參數(shù)資料
| 型號： | TGB2010-EPU |
| 廠商： | TriQuint Semiconductor,Inc. |
| 英文描述： | Bessel Filter |
| 中文描述： | Bessel濾波器 |
| 文件頁數(shù)： | 7/7頁 |
| 文件大小： | 214K |
| 代理商： | TGB2010-EPU |
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
September 22, 2003
7
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Reflow process assembly notes:
Use AuSn (80/20) solder with limited exposure to temperatures at or above 300 C.
(30 seconds maximum)
An alloy station or conveyor furnace with reducing atmosphere should be used.
No fluxes should be utilized.
Coefficient of thermal expansion matching is critical for long-term reliability.
Devices must be stored in a dry nitrogen atmosphere.
Component placement and adhesive attachment assembly notes:
Vacuum pencils and/or vacuum collets are the preferred method of pick up.
Air bridges must be avoided during placement.
The force impact is critical during auto placement.
Organic attachment can be used in low-power applications.
Curing should be done in a convection oven; proper exhaust is a safety concern.
Microwave or radiant curing should not be used because of differential heating.
Coefficient of thermal expansion matching is critical.
Interconnect process assembly notes:
Thermosonic ball bonding is the preferred interconnect technique.
Force, time, and ultrasonics are critical parameters.
Aluminum wire should not be used.
Maximum stage temperature is 200 C.
Assembly Process Notes
TGB2010-EPU
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PDF描述 |
|---|---|
| TGB2010-00-EPU | Bessel Filter |
| TGC1411 | 0.3 - 10 GHz Downconverter |
| TGC1411-EPU | 0.3 - 10 GHz Downconverter |
| TGC1430E | Single-Balanced Down Converter |
| TGC1430F-EPU | 20 - 40 GHz X2 Frequency Multiplier |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| TGB2010-EPU-SM | 制造商:TRIQUINT 制造商全稱:TriQuint Semiconductor 功能描述:5GHz - 9GHz Packaged Bessel Filter |
| TGB2010-SM | 制造商:TRIQUINT 制造商全稱:TriQuint Semiconductor 功能描述:5GHz - 9GHz Packaged Bessel Filter |
| TGB-240NSRL | 制造商:Halo Electronics Inc 功能描述: |
| TGB34 | 制造商:PCTEL 功能描述:ANTENNA HARDWARE/ACCESSORY |
| TGB4001 | 功能描述:射頻無線雜項 Lange Coupler 18-32 GHz RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
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