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參數(shù)資料
| 型號： | TGC1430F-EPU |
| 廠商： | TRIQUINT SEMICONDUCTOR INC |
| 元件分類： | 衰減器 |
| 英文描述： | 20 - 40 GHz X2 Frequency Multiplier |
| 中文描述： | 10000 MHz - 20000 MHz RF/MICROWAVE FREQUENCY DOUBLER |
| 封裝： | 1.50 X 1.50 MM, DIE-2 |
| 文件頁數(shù)： | 4/4頁 |
| 文件大小： | 110K |
| 代理商： | TGC1430F-EPU |
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
June 29, 2004
Assembly Process Notes
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
TGC1430F-EPU
Reflow process assembly notes:
Use AuSn (80/20) solder with limited exposure to temperatures at or above 300
0
C (30 seconds max).
An alloy station or conveyor furnace with reducing atmosphere should be used.
No fluxes should be utilized.
Coefficient of thermal expansion matching is critical for long-term reliability.
Devices must be stored in a dry nitrogen atmosphere.
Component placement and adhesive attachment assembly notes:
Vacuum pencils and/or vacuum collets are the preferred method of pick up.
Air bridges must be avoided during placement.
The force impact is critical during auto placement.
Organic attachment can be used in low-power applications.
Curing should be done in a convection oven; proper exhaust is a safety concern.
Microwave or radiant curing should not be used because of differential heating.
Coefficient of thermal expansion matching is critical.
Interconnect process assembly notes:
Thermosonic ball bonding is the preferred interconnect technique.
Force, time, and ultrasonics are critical parameters.
Aluminum wire should not be used.
Maximum stage temperature is 200
0
C.
相關PDF資料 |
PDF描述 |
|---|---|
| TGC1430F | 20 - 40 GHz X2 Frequency Multiplier |
| TGC1430G-EPU | 20 - 40 GHz X3 Frequency Multiplier |
| TGC1430G | 20 - 40 GHz X3 Frequency Multiplier |
| TGC1430H | 20 - 40 GHz IQ Mixer |
| TGC1439A-EPU | TRANSISTOR PNP 60V SOT523 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| TGC1430G | 功能描述:時鐘發(fā)生器及支持產(chǎn)品 20-40GHz Tripler RoHS:否 制造商:Silicon Labs 類型:Clock Generators 最大輸入頻率:14.318 MHz 最大輸出頻率:166 MHz 輸出端數(shù)量:16 占空比 - 最大:55 % 工作電源電壓:3.3 V 工作電源電流:1 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-56 |
| TGC1430G-EPU | 制造商:TRIQUINT 制造商全稱:TriQuint Semiconductor 功能描述:20 - 40 GHz X3 Frequency Multiplier |
| TGC1430H | 制造商:TRIQUINT 制造商全稱:TriQuint Semiconductor 功能描述:20 - 40 GHz IQ Mixer |
| TGC1439A | 制造商:TRIQUINT 制造商全稱:TriQuint Semiconductor 功能描述:18 - 20 GHz 5-Bit Phase Shifter |
| TGC1439A-EPU | 制造商:TRIQUINT 制造商全稱:TriQuint Semiconductor 功能描述:18 - 20 GHz 5-Bit Phase Shifter |
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