參數(shù)資料
型號: TGC4405
廠商: TRIQUINT SEMICONDUCTOR INC
元件分類: 衰減器
英文描述: 17 - 27 GHz Upconverter
中文描述: 1700 MHz - 2700 MHz RF/MICROWAVE UP CONVERTER
封裝: 2.07 X 1.93 MM, 0.1 MM HEIGHT, ROHS COMPLIANT PACKAGE-10
文件頁數(shù): 11/11頁
文件大?。?/td> 424K
代理商: TGC4405
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
11
TGC4405
Oct 2006 Rev -
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Assembly Notes
Ordering Information
Part
Package Style
TGC4405
GaAs MMIC Die
Component placement and adhesive attachment assembly notes:
1.
Vacuum pencils and/or vacuum collets are the preferred method of pick up.
2.
Air bridges must be avoided during placement.
3.
The force impact is critical during auto placement.
4.
Organic attachment (i.e. epoxy) can be used in low-power applications.
5.
Curing should be done in a convection oven; proper exhaust is a safety concern.
Reflow process assembly notes:
1.
Use AuSn (80/20) solder and limit exposure to temperatures above 300
°
C to 3-4 minutes, maximum.
2.
An alloy station or conveyor furnace with reducing atmosphere should be used.
3.
Do not use any kind of flux.
4.
Coefficient of thermal expansion matching is critical for long-term reliability.
5.
Devices must be stored in a dry nitrogen atmosphere.
Interconnect process assembly notes:
1.
Thermosonic ball bonding is the preferred interconnect technique.
2.
Force, time, and ultrasonics are critical parameters.
3.
Aluminum wire should not be used.
4.
Devices with small pad sizes should be bonded with 0.0007-inch wire.
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