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參數(shù)資料
| 型號： | TGF4350 |
| 廠商： | TRIQUINT SEMICONDUCTOR INC |
| 元件分類： | 衰減器 |
| 英文描述： | 300um Discrete pHEMT |
| 中文描述： | 0 MHz - 22000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | 0.62 X 0.514 MM, DIE-6 |
| 文件頁數(shù)： | 5/5頁 |
| 文件大?。?/td> | 554K |
| 代理商： | TGF4350 |
TriQuint Semiconductor Texas : Phone (972)994 8465 Fax (972)994 8504 Web: www.triquint.com
Advance Product Information
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Component placement and adhesive attachment assembly notes:
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vacuum pencils and/or vacuum collets preferred method of pick up
avoidance of air bridges during placement
force impact critical during auto placement
organic attachment can be used in low-power applications
curing should be done in a convection oven; proper exhaust is a safety concern
microwave or radiant curing should not be used because of differential heating
coefficient of thermal expansion matching is critical
Interconnect process assembly notes:
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thermosonic ball bonding is the preferred interconnect technique
force, time, and ultrasonics are critical parameters
aluminum wire should not be used
discrete FET devices with small pad sizes should be bonded with 0.0007-inch wire
maximum stage temperature: 200
Γ
C
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Process and Assembly Notes
TGF4350-EPU
This device should be attached using conductive epoxy only.
Contact factory for additional details as required.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TGF4350-EPU | 300um Discrete pHEMT |
| TGL2201-EPU | Wideband Dual Stage VPIN Limiter |
| TGL4201-00-EPU | Wideband Fixed Attenuators |
| TGL4201-02-EPU | Wideband Fixed Attenuators |
| TGL4201-03-EPU | Wideband Fixed Attenuators |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TGF4350-EPU | 制造商:TRIQUINT 制造商全稱:TriQuint Semiconductor 功能描述:300um Discrete pHEMT |
| TGF50-07870787-020 | 功能描述:THERMAL GAP FILLER/WHITE 5.0W/M- 制造商:leader tech inc. 系列:TGF50 零件狀態(tài):在售 使用:片狀 形狀:方形 外形:199.90mm x 199.90mm 厚度:0.0200"（0.508mm） 材料:氧化鋁填充硅膠 粘合劑:膠粘 - 兩側(cè) 底布，載體:- 顏色:白色 熱阻率:0.70°C/W 導(dǎo)熱率:5.0 W/m-K 標(biāo)準(zhǔn)包裝:25 |
| TGF50-07870787-039 | 功能描述:THERMAL GAP FILLER/WHITE 5.0W/M- 制造商:leader tech inc. 系列:TGF50 零件狀態(tài):在售 使用:片狀 形狀:方形 外形:199.90mm x 199.90mm 厚度:0.0390"（0.991mm） 材料:氧化鋁填充硅膠 粘合劑:膠粘 - 兩側(cè) 底布，載體:- 顏色:白色 熱阻率:0.70°C/W 導(dǎo)熱率:5.0 W/m-K 標(biāo)準(zhǔn)包裝:25 |
| TGF50-07870787-059 | 功能描述:THERMAL GAP FILLER/WHITE 5.0W/M- 制造商:leader tech inc. 系列:TGF50 零件狀態(tài):在售 使用:片狀 形狀:方形 外形:199.90mm x 199.90mm 厚度:0.0591"（1.500mm） 材料:氧化鋁填充硅膠 粘合劑:膠粘 - 兩側(cè) 底布，載體:- 顏色:白色 熱阻率:0.70°C/W 導(dǎo)熱率:5.0 W/m-K 標(biāo)準(zhǔn)包裝:25 |
| TGF50-07870787-079 | 功能描述:THERMAL GAP FILLER/WHITE 5.0W/M- 制造商:leader tech inc. 系列:TGF50 零件狀態(tài):在售 使用:片狀 形狀:方形 外形:199.90mm x 199.90mm 厚度:0.0790"（2.007 mm） 材料:氧化鋁填充硅膠 粘合劑:膠粘 - 兩側(cè) 底布，載體:- 顏色:白色 熱阻率:0.70°C/W 導(dǎo)熱率:5.0 W/m-K 標(biāo)準(zhǔn)包裝:25 |
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