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參數(shù)資料
| 型號(hào)： | TGS4302 |
| 廠商： | TRIQUINT SEMICONDUCTOR INC |
| 元件分類： | 衰減器 |
| 英文描述： | High Power Ka-Band SPDT Switch |
| 中文描述： | 27000 MHz - 46000 MHz RF/MICROWAVE DIVERSITY SWITCH |
| 封裝： | 0.043 X 0.043 INCH, 0.004 INCH HEIGHT, DIE-7 |
| 文件頁(yè)數(shù)： | 11/11頁(yè) |
| 文件大小： | 129K |
| 代理商： | TGS4302 |
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
Advance Product Information
February 6, 2006
TGS4302
11
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Reflow process assembly notes:
Use AuSn (80/20) solder with limited exposure to temperatures at or above 300
°
C.
(30 seconds maximum)
An alloy station or conveyor furnace with reducing atmosphere should be used.
No fluxes should be utilized.
Coefficient of thermal expansion matching is critical for long-term reliability.
Devices must be stored in a dry nitrogen atmosphere.
Component placement and adhesive attachment assembly notes:
Vacuum pencils and/or vacuum collets are the preferred method of pick up.
Air bridges must be avoided during placement.
The force impact is critical during auto placement.
Organic attachment can be used in low-power applications.
Curing should be done in a convection oven; proper exhaust is a safety concern.
Microwave or radiant curing should not be used because of differential heating.
Coefficient of thermal expansion matching is critical.
Interconnect process assembly notes:
Thermosonic ball bonding is the preferred interconnect technique.
Force, time, and ultrasonics are critical parameters.
Aluminum wire should not be used.
Maximum stage temperature is 200
°
C.
Assembly Process Notes
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| TGS4304 | High Power Ka-Band Absorptive SPDT Switch |
| TGS4307-EPU | 77 GHz Transceiver Switch |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TGS4304 | 功能描述:RF 開關(guān) IC 32-40 GHz SPDT VPIN Switch Absorptive RoHS:否 制造商:M/A-COM Technology Solutions 開關(guān)數(shù)量:Single 開關(guān)配置:SPDT 介入損耗:0.6 dB 截止隔離（典型值）:43 dB 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN-16 封裝:Reel |
| TGS4305-FC | 功能描述:RF 開關(guān) IC 77GHz SP3T RoHS:否 制造商:M/A-COM Technology Solutions 開關(guān)數(shù)量:Single 開關(guān)配置:SPDT 介入損耗:0.6 dB 截止隔離（典型值）:43 dB 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN-16 封裝:Reel |
| TGS4306-FC | 功能描述:RF 開關(guān) IC 77GHz SP4T RoHS:否 制造商:M/A-COM Technology Solutions 開關(guān)數(shù)量:Single 開關(guān)配置:SPDT 介入損耗:0.6 dB 截止隔離（典型值）:43 dB 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN-16 封裝:Reel |
| TGS4307 | 功能描述:RF 開關(guān) IC 77 GHz SP5T VPIN Switch RoHS:否 制造商:M/A-COM Technology Solutions 開關(guān)數(shù)量:Single 開關(guān)配置:SPDT 介入損耗:0.6 dB 截止隔離（典型值）:43 dB 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFN-16 封裝:Reel |
| TGS4307-EPU | 制造商:TRIQUINT 制造商全稱:TriQuint Semiconductor 功能描述:77 GHz Transceiver Switch |
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