參數(shù)資料
型號： THS3112CDDARG3
廠商： TEXAS INSTRUMENTS INC
元件分類： 音頻／視頻放大
英文描述： 1 CHANNEL, VIDEO AMPLIFIER, PDSO8
封裝： GREEN, PLASTIC, SOP-8
文件頁數(shù)： 9/31頁
文件大?。?/td> 1373K
代理商： THS3112CDDARG3
0.205
(5,21)
0.060
(1,52)
0.013
(0,33)
0.017
(0,432)
0.025
(0,64)
0.094
(2,39)
0.040
(1,01)
0.035
(0,89)
0.075
(1,91)
0.010
vias
(0,254)
0.030
(0,76)
Pin1
TopView
P
=
DMax
T
-
max
A
q
JA
www.ti.com........................................................................................................................................ SLOS385B – SEPTEMBER 2001 – REVISED OCTOBER 2009
PowerPAD Layout Considerations
THS3115/THS3112 PowerPAD package should
make the connection to the internal ground plane
with a complete connection around the entire
circumference of the plated-through hole.
6. The top-side solder mask should leave the
terminals of the package and the thermal pad
area with its five holes exposed. The bottom-side
solder mask should cover the five holes of the
thermal pad area. This configuration prevents
solder from being pulled away from the thermal
pad area during the reflow process.
7. Apply solder paste to the exposed thermal pad
area and all of the IC terminals.
8. With these preparatory steps in place, the IC is
simply placed in position and run through the
solder
reflow
operation
as
any
standard
surface-mount component. This procedure results
in a part that is properly installed.
Dimensions are in inches (millimeters).
Power Dissipation and Thermal
Figure 51. DGN PowerPAD PCB Etch and Via
Considerations
Pattern
The THS3115 and THS3112 incorporate automatic
Although there are many ways to properly heatsink
thermal shutoff protection. This protection circuitry
the PowerPAD package, the following steps illustrate
shuts down the amplifier if the junction temperature
the recommended approach.
exceeds approximately +160°C. When the junction
temperature reduces to approximately +140°C, the
1. PCB with a top side etch pattern as shown in
amplifier turns on again. However, for maximum
performance and reliability, the designer must take
2. Place five holes in the area of the thermal pad.
care to ensure that the design does not exceed a
These holes should be 0.01 inch (0,254 mm) in
junction temperature of +125°C. Between +125°C
diameter. Keep them small so that solder wicking
and +150°C, damage does not occur, but the
through the holes is not a problem during reflow.
performance of the amplifier begins to degrade and
3. Additional vias may be placed anywhere along
long-term
reliability
suffers.
The
thermal
the thermal plane outside of the thermal pad
characteristics of the device are dictated by the
area.
These
vias
help
dissipate
the
heat
package and the PCB. Maximum power dissipation
generated by the THS3115/THS3112 IC. These
for a given package can be calculated using the
additional vias may be larger than the 0.01-inch
following formula.
(0,254-mm) diameter vias directly under the
thermal pad. They can be larger because they
are not in the thermal pad area to be soldered so
that wicking is not a problem.
where:
4. Connect all holes to the internal ground plane.
PDMax is the maximum power dissipation in the
Note that the PowerPAD is electrically isolated
amplifier (W)
from the silicon and all leads. Connecting the
Tmax is the absolute maximum junction
PowerPAD to any potential voltage, such as VS–,
temperature (°C)
is acceptable as there is no electrical connection
TA is the ambient temperature (°C)
to the silicon.
θJA = θJC + θCA
5. When connecting these holes to the ground
plane, do not use the typical web or spoke via
where:
connection methodology. Web connections have
θJC is the thermal coefficient from the silicon
a high thermal resistance connection that is
junctions to the case (°C/W)
useful for slowing the heat transfer during
θCA is the thermal coefficient from the case to
soldering operations. This resistance makes the
ambient air (°C/W)
soldering of vias that have plane connections
easier. In this application; however, low thermal
resistance is desired for the most efficient heat
transfer.
Therefore,
the
holes
under
the
Copyright 2001–2009, Texas Instruments Incorporated
17
Product Folder Link(s): THS3112 THS3115
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