參數(shù)資料
型號(hào)： THS4031CDRG4
廠商： Texas Instruments
文件頁(yè)數(shù)： 22/47頁(yè)
文件大?。?/td> 0K
描述： IC OPAMP VFB 100MHZ SGL 8SOIC
標(biāo)準(zhǔn)包裝： 2,500
放大器類型： 電壓反饋
電路數(shù)： 1
轉(zhuǎn)換速率： 100 V/µs
-3db帶寬： 100MHz
電流 - 輸入偏壓： 3µA
電壓 - 輸入偏移： 500µV
電流 - 電源： 8.5mA
電流 - 輸出 / 通道： 90mA
電壓 - 電源，單路/雙路(±)： 9 V ~ 32 V，±4.5 V ~ 16 V
工作溫度： 0°C ~ 70°C
安裝類型： 表面貼裝
封裝/外殼： 8-SOIC（0.154"，3.90mm 寬）
供應(yīng)商設(shè)備封裝： 8-SOIC
包裝： 帶卷 (TR)
配用： 296-10029-ND - EVAL MOD FOR THS4031
Thermal pad area (68 mils x 70 mils) with 5 vias
(Via diameter = 13 mils)
www.ti.com
SLOS224G – JULY 1999 – REVISED MARCH 2010
Although there are many ways to properly heatsink this device, the following steps illustrate the recommended
approach.
Figure 61. PowerPAD PCB Etch and Via Pattern
1. Prepare the PCB with a top-side etch pattern as shown in Figure 61. There should be etch for the leads as
well as etch for the thermal pad.
2. Place five holes in the area of the thermal pad. These holes should be 13 mils (0,3302 mm) in diameter.
They are kept small so that solder wicking through the holes is not a problem during reflow.
3. Additional vias may be placed anywhere along the thermal plane outside of the thermal pad area. This helps
dissipate the heat generated by the THS403xDGN IC. These additional vias may be larger than the 13-mil
diameter vias directly under the thermal pad. They can be larger because they are not in the thermal pad
area to be soldered so that wicking is not a problem.
4. Connect all holes to the internal ground plane.
5. When connecting these holes to the ground plane, do not use the typical web or spoke via connection
methodology. Web connections have a high thermal-resistance connection that is useful for slowing the heat
transfer during soldering operations. This makes the soldering of vias that have plane connections easier. In
this application, however, low thermal resistance is desired for the most efficient heat transfer. Therefore, the
holes under the THS403xDGN package should connect to the internal ground plane with a complete
connection around the entire circumference of the plated-through hole.
6. The top-side solder mask should leave the terminals of the package and the thermal pad area with its five
holes exposed. The bottom-side solder mask should cover the five holes of the thermal pad area, which
prevents solder from being pulled away from the thermal pad area during the reflow process.
7. Apply solder paste to the exposed thermal pad area and to all the IC terminals.
8. With these preparatory steps in place, the THS403xDGN IC is simply placed in position and run through the
solder reflow operation as any standard surface-mount component. This results in a part that is properly
installed.
Copyright 1999–2010, Texas Instruments Incorporated
29
Product Folder Link(s): THS4031 THS4032
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