參數(shù)資料
型號(hào): THS4505DGKR
廠商: Texas Instruments, Inc.
元件分類: 運(yùn)動(dòng)控制電子
英文描述: WIDEBAND, LOW-DISTORTION, FULLY DIFFERENTIAL AMPLIFIERS
中文描述: 寬帶,低失真,全差分放大器
文件頁(yè)數(shù): 2/38頁(yè)
文件大?。?/td> 1094K
代理商: THS4505DGKR
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
PACKAGE DISSIPATION RATINGS
RECOMMENDED OPERATING CONDITIONS
THS4504
THS4505
SLOS363C–AUGUST 2002–REVISED MARCH 2004
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
UNIT
16.5 V
±
V
S
150 mA
4 V
Supply voltage, V
S
Input voltage, V
I
Output current, I
O
Differential input voltage, V
ID
Continuous power dissipation
Maximum junction temperature, T
J
Maximum junction temperature, continuous operation, long-term reliability, T
J(2)
Storage temperature range, T
stg
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
See Dissipation Rating Table
150
°
C
125
°
C
-65
°
C to 150
°
C
300
°
C
(1)
The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may
cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.
The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
(2)
POWER RATING
(2)
PACKAGE
Θ
JC
(
°
C/W)
Θ
JA
(
°
C/W)
(1)
T
A
25
°
C
1.02 W
1.71 W
385 mW
T
A
= 85
°
C
410 mW
685 mW
154 mW
D (8 pin)
DGN (8 pin)
DGK (8 pin)
38.3
4.7
54.2
97.5
58.4
260
(1)
(2)
This data was taken using the JEDEC standard High-K test PCB.
Power rating is determined with a junction temperature of 125
°
C. This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the junction temperature at or below 125
°
C for best performance and long
term reliability.
MIN NOM
MAX
±
7.5
UNIT
Dual supply
Single supply
±
5
Supply voltage
V
4.5
-40
5
15
85
Operating free-air temperature, T
A
°
C
2
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