參數(shù)資料
型號(hào)： THS6002EVM
廠商： Texas Instruments, Inc.
英文描述： DUAL DIFFERENTIAL LINE DRIVERS AND RECEIVERS
中文描述： 雙差分線路驅(qū)動(dòng)與接收
文件頁(yè)數(shù)： 26/40頁(yè)
文件大?。?/td> 718K
代理商： THS6002EVM
THS6002
DUAL DIFFERENTIAL LINE DRIVERS AND RECEIVERS
SLOS202D– JANUARY 1998– REVISED JULY 1999
26
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
device protection features
The THS6002 has two built-in protection features that protect the device against improper operation. The first
protection mechanism is output current limiting. Should the output become shorted to ground the output current
is automatically limited to the value given in the data sheet. While this protects the output against excessive
current, the device internal power dissipation increases due to the high current and large voltage drop across
the output transistors. Continuous output shorts are not recommended and could damage the device.
Additionally, connection of the amplifier output to one of the supply rails (
±
V
CC
) can cause failure of the device
and is not recommended.
The second built-in protection feature is thermal shutdown. Should the internal junction temperature rise above
approximately 180 C, the device automatically shuts down. Such a condition could exist with improper heat
sinking or if the output is shorted to ground. When the abnormal condition is fixed, the internal thermal shutdown
circuit automatically turns the device back on.
thermal information
The THS6002 is packaged in a thermally-enhanced DWP package, which is a member of the PowerPAD family
of packages. This package is constructed using a downset leadframe upon which the die is mounted
[see Figure 52(a) and Figure 52(b)]. This arrangement results in the lead frame being exposed as a thermal pad
on the underside of the package [see Figure 52(c)]. Because this thermal pad has direct thermal contact with
the die, excellent thermal performance can be achieved by providing a good thermal path away from the thermal
pad.
The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be
soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either a ground plane or other heat dissipating device. This
is discussed in more detail in the PCB design considerationssection of this document.
The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of
surface mount with the, heretofore, awkward mechanical methods of heatsinking.
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
NOTE A: The thermal pad is electrically isolated from all terminals in the package.
Figure 52. Views of Thermally Enhanced DWP Package
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
THS6002IDWP 功能描述:緩沖器和線路驅(qū)動(dòng)器 Dual Diff/Receiver Line Driver RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
THS6002IDWP 制造商:Texas Instruments 功能描述:TRANSCEIVER DUAL SMD 6002 SOIC20
THS6002IDWPG4 功能描述:緩沖器和線路驅(qū)動(dòng)器 Dual Diff/Receiver Line Driver RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
THS6002IDWPR 功能描述:緩沖器和線路驅(qū)動(dòng)器 Dual Diff/Receiver Line Driver RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
THS6002IDWPRG4 功能描述:緩沖器和線路驅(qū)動(dòng)器 Dual Diff/Receiver Line Driver RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
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