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參數資料
| 型號： | THS6182DRG4 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | LOW-POWER DISSIPATION ADSL LINE DRIVER |
| 中文描述： | 低功耗ADSL線路驅動器 |
| 文件頁數： | 20/35頁 |
| 文件大小： | 1242K |
| 代理商： | THS6182DRG4 |
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0.1025
0.080
0.178
0.026
0.024
0.021
0.0165
0.450
0.476
.039
0.026
0.120
0.085
PowerPAD and via placement
pad area (0.085 x 0.120) with 15
vias (Via diameter = 0.013)
Vias should go through the board connecting the top layer
PowerPad to any and all ground planes. (The larger the ground
plane, the larger the area to distribute the heat.) Solder resist should
be used on the bottom side ground plane in order to prevent wicking
of the solder through the vias during the reflow process.
All Units in Inches
THS6182
SLLS544G–SEPTEMBER 2002–REVISED NOVEMBER 2004
APPLICATION INFORMATION (continued)
transfer during soldering operations. This makes the soldering of vias that have plane connections easier.
However, in this application, low thermal resistance is desired for the most efficient heat transfer. Therefore,
the holes under the THS6182 package should make their connection to the internal ground plane with a
complete connection around the entire circumference of the plated through hole.
6. The top-side solder mask should leave exposed the terminals of the package and the thermal pad area with
its five holes. The four larger holes outside the thermal pad area, but still under the package, should be
covered with solder mask.
7. Apply solder paste to the exposed thermal pad area and all of the operational amplifier terminals.
8. With these preparatory steps in place, the THS6182 DWP is simply placed in position and run through the
solder reflow operation as any standard surface-mount component. This results in a part that is properly
installed.
Figure 73. 20-Pin DWP PowerPAD PCB Etch and Via Pattern
The RHF package is similar to the DWP package with respect to PCB mounting procedures. The recommended
PCB layout is as shown in
Figure 74
.
20
相關PDF資料 |
PDF描述 |
|---|---|
| THS6182DR | LOW-POWER DISSIPATION ADSL LINE DRIVER |
| THS6182DWRG4 | LOW-POWER DISSIPATION ADSL LINE DRIVER |
| TIED87 | REFERENCE DIODE PAIRS |
| TIED88 | REFERENCE DIODE PAIRS |
| TIED89 | REFERENCE DIODE PAIRS |
相關代理商/技術參數 |
參數描述 |
|---|---|
| THS6182DW | 功能描述:緩沖器和線路驅動器 Low Pwr Dissipation Line Driver RoHS:否 制造商:Micrel 輸入線路數量:1 輸出線路數量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| THS6182DWEVM | 功能描述:其他開發(fā)工具 THS6182DW Eval Mod RoHS:否 制造商:Parallax 產品:ELEV-8 Hex Upgrade Kits 類型:Robotics 工具用于評估:ELEV-8 Quadcopter 工作電源電壓: |
| THS6182DWG4 | 功能描述:緩沖器和線路驅動器 Low Pwr Dissipation Line Driver RoHS:否 制造商:Micrel 輸入線路數量:1 輸出線路數量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| THS6182DWP | 功能描述:緩沖器和線路驅動器 Low Pwr Dissipation Line Driver RoHS:否 制造商:Micrel 輸入線路數量:1 輸出線路數量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| THS6182DWPG4 | 功能描述:緩沖器和線路驅動器 Low Pwr Dissipation Line Driver RoHS:否 制造商:Micrel 輸入線路數量:1 輸出線路數量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
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