參數(shù)資料
    型號: TK71731
    廠商: TOKO Inc.
    元件分類: 基準電壓源/電流源
    英文描述: LOW DROPOUT VOLTAGE REGULATOR
    中文描述: 低壓差穩(wěn)壓器
    文件頁數(shù): 8/13頁
    文件大?。?/td> 152K
    代理商: TK71731
    Page 8
    October 2001 TOKO, Inc.
    TK717xxS
    DEFINITION AND EXPLANATION OF TECHNICAL TERMS (CONT.)
    PACKAGE POWER DISSIPATION (P
    D
    )
    This is the power dissipation level at which the thermal
    sensor is activated. The IC contains an internal thermal
    sensor which monitors the junction temperature. When the
    junction temperature exceeds the monitor threshold of
    150 °C, the IC is shut down. The junction temperature rises
    as the difference between the input power (V
    IN
    x I
    IN
    ) and the
    output power (V
    OUT
    x I
    OUT
    ) increases. The rate of tempera-
    ture rise is greatly affected by the mounting pad configura-
    tion on the PCB, the board material, and the ambient
    temperature. When the IC mounting has good thermal
    conductivity, the junction temperature will be low even if the
    power dissipation is great. When mounted on the recom-
    mended mounting pad, the power dissipation of the SOT23-
    5 is increased to 500 mW. For operation at ambient
    temperatures over 25 °C, the power dissipation of the
    SOT23-5 device should be derated at 4.0 mW/ °C. For
    operation above 25 °C: To determine the power dissipation
    for shutdown when mounted, attach the device on the actual
    PCB and deliberately increase the output current (or raise
    the input voltage) until the thermal protection circuit is
    activated. Calculate the power dissipation of the device by
    subtracting the output power from the input power. These
    measurements should allow for the ambient temperature of
    the PCB. The value obtained from P
    D
    /(150 °C - T
    A
    ) is the
    derating factor. The PCB mounting pad should provide
    maximum thermal conductivity in order to maintain low
    device temperatures. As a general rule, the lower the
    temperature, the better the reliability of the device. The
    thermal resistance when mounted is expressed as follows:
    T
    j
    = 0
    jA
    x P
    D
    + T
    A
    For Toko ICs, the internal limit for junction temperature is
    150 °C. If the ambient temperature (T
    A
    ) is 25 °C, then:
    150 °C = 0
    jA
    x P
    D
    + 25 °C
    0
    jA
    = 125 °C / P
    D
    0
    jA
    = 125 °C / P
    D
    (°C / mW)
    P
    D
    is the value when the thermal protection circuit is
    activated. A simple way to determine P
    D
    is to calculate V
    IN
    x I
    IN
    when the output side is shorted. Input current gradually
    falls as temperature rises. You should use the value when
    thermal equilibrium is reached.
    The range of usable currents can also be found from the
    graph below.
    Procedure:
    1) Find P
    D
    2) P
    D1
    is taken to be P
    D
    x (~0.8 - 0.9)
    3) Plot P
    D1
    against 25 °C
    4) Connect P
    D1
    to the point corresponding to the 150 °C with
    a straight line.
    5) In design, take a vertical line from the maximum
    operating temperature (e.g., 75 °C) to the derating curve.
    6) Read off the value of P
    D
    against the point at which the
    vertical line intersects the derating curve. This is taken as
    the maximum power dissipation, D
    PD
    .
    The maximum operating current is:
    I
    OUT
    = (D
    PD
    / (V
    IN(MAX)
    -
    V
    OUT
    )
    PD
    DPD
    25
    50
    75
    150
    TA (°C)
    3
    6
    5
    4
    PD(mW)
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