參數(shù)資料
型號(hào): TLC556lDR
廠商: TEXAS INSTRUMENTS INC
元件分類: 模擬波形發(fā)生器
英文描述: DUAL PULSE; RECTANGULAR, 1.2 MHz, TIMER, PDSO14
封裝: PLASTIC, MS-012AB, SOIC-14
文件頁數(shù): 18/24頁
文件大小: 681K
代理商: TLC556LDR
TLC556, TLC556Y
DUAL LinCMOS
TIMERS
SLFS047B – FEBRUARY 1984 – REVISED SEPTEMBER 1997
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLC556Y chip information
These chips, properly assembled, display characteristics similar to the TLC556 (see electrical table). Thermal
compression or ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be mounted
with conductive epoxy or a gold-silicon preform.
OUT
DISCH
R1
R
S
1
RESET
CONT
VDD
THRESH
R
GND
TRIG
(3)
(5)
(1)
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
× 4 MINIMUM
TJ max = 150°C
TOLERANCES ARE
±10%
ALL DIMENSIONS ARE IN MILS
NO BACKSIDE METALLIZATION
PIN (7) INTERNALLY CONNECTED
TO BACKSIDE OF CHIP
FUNCTIONAL BLOCK DIAGRAM (EACH TIMER)
(4)
(14)
(2)
(6)
(7)
61
97
相關(guān)PDF資料
PDF描述
TLC556lD DUAL PULSE; RECTANGULAR, 1.2 MHz, TIMER, PDSO14
TLC556MFK DUAL PULSE; RECTANGULAR, 1.2 MHz, TIMER, CQCC20
TLC5602CDW PARALLEL, 8 BITS INPUT LOADING, 0.03 us SETTLING TIME, 8-BIT DAC, PDSO20
TLC5602CDWG4 PARALLEL, 8 BITS INPUT LOADING, 0.03 us SETTLING TIME, 8-BIT DAC, PDSO20
TLC5602CDWRG4 PARALLEL, 8 BITS INPUT LOADING, 0.03 us SETTLING TIME, 8-BIT DAC, PDSO20
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