參數(shù)資料
型號： TLV1393Y
廠商： Texas Instruments, Inc.
英文描述： DUAL DIFFERENTIAL COMPARATORS
中文描述： 雙差分比較器
文件頁數(shù)： 4/16頁
文件大?。?/td> 254K
代理商： TLV1393Y
TLV1393, TLV1393Y, TLV2393, TLV2393Y
DUAL DIFFERENTIAL COMPARATORS
SLCS121A – AUGUST 1993 – REVISED APRIL 1994
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLV1393Y chip information
This chip, when properly assembled, displays characteristics similar to the TLV1393. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 13 TYPICAL
BONDING PADS: 3.54
×
3.54 MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
–
1OUT
1IN+
1IN–
VCC
(8)
(6)
(3)
(2)
(5)
(1)
–
+
(7)
2IN+
2IN–
2OUT
(4)
GND
32
38
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
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