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參數(shù)資料
| 型號： | TLV2322Y |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | LinCMOSE LOW-VOLTAGE LOW-POWER OPERATIONAL AMPLIFIERS |
| 中文描述： | LinCMOSE低壓低功耗運算放大器 |
| 文件頁數(shù)： | 2/33頁 |
| 文件大小： | 502K |
| 代理商： | TLV2322Y |
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TLV2322, TLV2322Y, TLV2324, TLV2324Y
LinCMOS
LOW-VOLTAGE LOW-POWER
OPERATIONAL AMPLIFIERS
SLOS187 – FEBRUARY 1997
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
description (continued)
Low-voltage and low-power operation has been made possible by using the Texas Instruments silicon-gate
LinCMOS technology. The LinCMOS process also features extremely high input impedance and ultra-low bias
currents making these amplifiers ideal for interfacing to high-impedance sources such as sensor circuits or filter
applications.
To facilitate the design of small portable equipment, the TLV232x is made available in a wide range of package
options, including the small-outline and thin-shrink small-outline packages (TSSOP). The TSSOP package has
significantly reduced dimensions compared to a standard surface-mount package. Its maximum height of only
1.1 mm makes it particularly attractive when space is critical.
The device inputs and outputs are designed to withstand –100-mA currents without sustaining latch-up. The
TLV232x incorporates internal ESD-protection circuits that prevent functional failures at voltages up to 2000 V
as tested under MIL-STD 883C, Method 3015.2; however, care should be exercised in handling these devices
as exposure to ESD can result in the degradation of the device parametric performance.
TLV2322Y chip information
This chip, when properly assembled, displays characteristics similar to the TLV2322I. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
×
4 MILS MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
+
–
1OUT
1IN+
1IN–
VDD
VDD–/GND
(8)
(3)
(2)
(4)
+
–
2OUT
2IN+
2IN–
(5)
(6)
59
72
(5)
(4)
(3)
(2)
(6)
(7)
(8)
(1)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TLV2324Y | Inductive DC |
| TLV2341(中文) | LINCMOS<TM> Programmable Low-Voltage OP AMP(電源電流可編程，低電壓運放) |
| TLV2342(中文) | Dual LINCMOS<TM> Programmable Low-Voltage OP AMP(LICMOS，低電壓，高速雙運放) |
| TLV2342Y | LinCMOSE LOW-VOLTAGE HIGH-SPEED OPERATIONAL AMPLIFIERS |
| TLV2344ID | LinCMOSE LOW-VOLTAGE HIGH-SPEED OPERATIONAL AMPLIFIERS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLV2324 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:LinCMOSE LOW-VOLTAGE LOW-POWER OPERATIONAL AMPLIFIERS |
| TLV2324ID | 功能描述:運算放大器 - 運放 Quad LiNCMOS RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| TLV2324IDG4 | 功能描述:運算放大器 - 運放 Quad LiNCMOS RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| TLV2324IDR | 功能描述:運算放大器 - 運放 Quad Lo-Vltg Mcrpwr Op Amp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
| TLV2324IDRG4 | 功能描述:運算放大器 - 運放 Quad Lo-Vltg Mcrpwr Op Amp RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel |
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