參數(shù)資料
型號(hào)： TLV2344ID
廠商： Texas Instruments, Inc.
英文描述： LinCMOSE LOW-VOLTAGE HIGH-SPEED OPERATIONAL AMPLIFIERS
中文描述： LinCMOSE低壓高速運(yùn)算放大器
文件頁(yè)數(shù)： 2/34頁(yè)
文件大小： 519K
代理商： TLV2344ID
TLV2342, TLV2342Y, TLV2344, TLV2344Y
LinCMOS
LOW-VOLTAGE HIGH-SPEED
OPERATIONAL AMPLIFIERS
SLOS194 – FEBRUARY 1997
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
description (continued)
Low-voltage and low-power operation has been made possible by using the Texas Instruments silicon-gate
LinCMOS technology. The LinCMOS process also features extremely high input impedance and ultra-low input
bias currents. These parameters combined with good ac performance make the TLV234x effectual in
applications such as high-frequency filters and wide-bandwidth sensors.
To facilitate the design of small portable equipment, the TLV234x is made available in a wide range of package
options, including the small-outline and thin-shrink small-outline packages (TSSOP). The TSSOP package has
significantly reduced dimensions compared to a standard surface-mount package. Its maximum height of only
1.1 mm makes it particularly attractive when space is critical.
The device inputs and outputs are designed to withstand –100-mA currents without sustaining latch-up. The
TLV234x incorporates internal ESD-protection circuits that prevents functional failures at voltages up to
2000 V as tested under MIL-PRF-38535, Method 3015.2; however, care should be exercised in handling these
devices as exposure to ESD may result in the degradation of the device parametric performance.
TLV2342Y chip information
This chip, when properly assembled, displays characteristics similar to the TLV2342. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
×
4 MILS MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
+
–
1OUT
1IN+
1IN–
VDD
(8)
(6)
(3)
(2)
(5)
(1)
(7)
(4)
VDD–/GND
+
–
2OUT
2IN+
2IN–
59
72
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(1)
相關(guān)PDF資料
PDF描述
TLV2344Y LinCMOSE LOW-VOLTAGE HIGH-SPEED OPERATIONAL AMPLIFIERS
TLV2361(中文) Single High-Performance, Low-Voltage OP AMP(高性能，可編程低電壓?jiǎn)芜\(yùn)放)
TLV2362(中文) Dual High-Performance, Low-Voltage OP AMP(高性能，可編程低電壓雙運(yùn)放)
TLV2432(中文) Advanced Lincmos Rail-TO-Rail Output Wide-Input-Voltage Dual OP AMP(寬輸入電壓，低功耗，中速，高輸出驅(qū)動(dòng)雙運(yùn)放)
TLV2442(中文) Advanced Lincmos Rail-TO-Rail Output Wide-Input-Voltage Dual OP AMP(雙路寬輸入電壓，高速，高輸出驅(qū)動(dòng)運(yùn)放)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TLV2344IDG4 功能描述:運(yùn)算放大器 - 運(yùn)放 Quad LiNCMOS RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLV2344IN 功能描述:運(yùn)算放大器 - 運(yùn)放 Quad LiNCMOS RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLV2344INE4 功能描述:運(yùn)算放大器 - 運(yùn)放 Quad LinCMOS Lo-Vltg High-Speed RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLV2344IPW 功能描述:運(yùn)算放大器 - 運(yùn)放 Quad LV HS RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLV2344IPWLE 制造商:TI 制造商全稱:Texas Instruments 功能描述:LinCMOSE LOW-VOLTAGE HIGH-SPEED OPERATIONAL AMPLIFIERS
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