參數(shù)資料
型號(hào): TLV61224DCKT
廠商: TEXAS INSTRUMENTS INC
元件分類: 穩(wěn)壓器
英文描述: BATTERY CHARGE CONTROLLER, PDSO6
封裝: GREEN, PLASTIC, SC-70, 6 PIN
文件頁(yè)數(shù): 10/17頁(yè)
文件大?。?/td> 769K
代理商: TLV61224DCKT
TLV61224
SLVSAM7
– MARCH 2011
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE DEVICE OPTIONS(1)
PACKAGE
OUTPUT VOLTAGE
TA
PACKAGE
PART NUMBER (2)
DC/DC
MARKING
–40°C to 85°C
3.0 V
QXC
6-Pin SC-70
TLV61224DCK
(1)
Contact the factory to check availability of other fixed output voltage versions.
(2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Voltage range(2)
VIN, L, VOUT, EN, FB
–0.3
7.5
V
Temperature range
Operating junction temperature, TJ
–40
150
°C
Storage, Tstg
–65
150
°C
ESD rating(3)
Human Body Model - (HBM)
2
kV
Machine Model (MM)
200
V
Charge Device Model - (CDM)
1.5
kV
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to network ground terminal.
(3)
ESD testing is performed according to the respective JESD22 JEDEC standard.
THERMAL INFORMATION
TLV61224
THERMAL METRIC(1)
UNITS
DCK (6) PINS
θJA
Junction-to-ambient thermal resistance
231.9
θJCtop
Junction-to-case (top) thermal resistance
55.8
θJB
Junction-to-board thermal resistance
77.3
°C/W
ψJT
Junction-to-top characterization parameter
0.7
ψJB
Junction-to-board characterization parameter
76.4
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
UNIT
VIN
Supply voltage at VIN
0.7
3.0
V
TA
Operating free air temperature range
–40
85
°C
TJ
Operating virtual junction temperature range
–40
125
°C
2
Copyright
2011, Texas Instruments Incorporated
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