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參數(shù)資料
| 型號(hào)： | TMMDB3TG |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | DIAC |
| 中文描述： | 移民部 |
| 文件頁數(shù)： | 4/4頁 |
| 文件大?。?/td> | 51K |
| 代理商： | TMMDB3TG |
TMMDB3
4/4
PACKAGE MECHANICAL DATA
(in millimeters)
MINIMELF
REF.
DIMENSIONS
Millimeters
Min.
Typ.
3.30
3.40
Inches
Typ.
0.134
Max.
3.6
Min.
0.130
Max.
0.142
A
B
1.59
1.60
1.62
0.063
0.063
0.064
C
0.40
0.45
0.50
0.016
0.018
0.020
D
1.50
0.059
B
O
/
A
C
C
D
O
/
0.05 E-F
O
/
F
E
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
2001 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
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2.5
5
2
FOOTPRINT
10
20
50
100
200
500
0
5
10
15
20
25
30
35
40
C(nF)
tp(μs)
Tj=25°C
0
10
22
68
47
33
Fig. 3:
Time duration while current pulse is higher
50mA versus C and Rs (typical values).
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