參數(shù)資料
型號(hào)： TMP320C40KGDC
廠商： Texas Instruments, Inc.
元件分類： 數(shù)字信號(hào)處理
英文描述： Floating-Point Digital Signal Processor Known Good Die(6個(gè)通訊口，獨(dú)立的智能DMA協(xié)處理器)
中文描述： 浮點(diǎn)數(shù)字信號(hào)處理器已知良品裸片（6個(gè)通訊口，獨(dú)立的智能DMA的協(xié)處理器）
文件頁(yè)數(shù)： 5/14頁(yè)
文件大?。?/td> 232K
代理商： TMP320C40KGDC
TMP320C40KGDC, SMJ320C40KGDC
FLOATING-POINT DIGITAL SIGNAL PROCESSORS
KNOWN GOOD DIE
SGUS024 – APRIL 1997
5
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251–1443
’320C40 (rev 5.0) known good die pad information
325
244
Die Side Number 4
Pad Number One
1
Die Side Number 1
81
Zero-Zero
(origin)
82
162
Die Side Number 2
243
Die Side Number 3
163
Die Designator
Figure 2. ’320C40 Die Numbering Format
(See Table 1)
Table 1 provides a reference for the following:
The ’C40 signal identities in relation to the pad numbers
The ’C40 X,Y coordinates, where bond pad 82 serves as the origin (0,0)
In addition, the following notes are significant:
A.
X,Y coordinate data is in microns.
B.
The active silicon dimensions are 12424.86
μ
m
×
12035.52
μ
m (489.16 mils
×
473.83 mils).
The die size is approximately 12598.40
μ
m
×
12192.00
μ
m (496.00 mils
×
480.00 mils).
Bond pad dimensions are 108.00
μ
m
×
108.00
μ
m (4.25 mils
×
4.25 mils).
Center of bond pad to edge of die min (without scribe) = 107.80
μ
m (4.24 mils).
Gold bump dimensions are approximately 92
μ
m
×
92
μ
m (3.62 mils
×
3.62 mils).
C.
D.
E.
F.
G.
Coordinate origin is at (0,0) (center of bond pad 82).
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