參數(shù)資料
型號： TMS320VC5409GGU
廠商： Texas Instruments, Inc.
元件分類： 數(shù)字信號處理
英文描述： FIXED-POINT DIGITAL SIGNAL PROCESSOR
中文描述： 定點(diǎn)數(shù)字信號處理器
文件頁數(shù)： 2/123頁
文件大?。?/td> 1205K
代理商： TMS320VC5409GGU
www.ti.com
Contents
TMS320F2808, TMS320F2806
TMS320F2801, UCD9501
Digital Signal Processors
SPRS230F–OCTOBER 2003–REVISED SEPTEMBER 2005
Revision History
...........................................................................................................................
8
1
Features
............................................................................................................................
11
2
Introduction
.......................................................................................................................
12
2.1
Pin Assignments
............................................................................................................
13
2.2
Signal Descriptions
.........................................................................................................
16
3
Functional Overview
...........................................................................................................
22
3.1
Memory Map
................................................................................................................
23
3.2
Brief Descriptions
...........................................................................................................
27
3.2.1
C28x CPU
.......................................................................................................
27
3.2.2
Memory Bus (Harvard Bus Architecture)
....................................................................
28
3.2.3
Peripheral Bus
..................................................................................................
28
3.2.4
Real-Time JTAG and Analysis
................................................................................
28
3.2.5
Flash
..............................................................................................................
28
3.2.6
M0, M1 SARAMs
...............................................................................................
29
3.2.7
L0, L1, H0 SARAMs
............................................................................................
29
3.2.8
Boot ROM
........................................................................................................
29
3.2.9
Security
..........................................................................................................
30
3.2.10
Peripheral Interrupt Expansion (PIE) Block
..................................................................
31
3.2.11
External Interrupts (XINT1, XINT2, XNMI)
...................................................................
31
3.2.12
Oscillator and PLL
..............................................................................................
31
3.2.13
Watchdog
........................................................................................................
31
3.2.14
Peripheral Clocking
.............................................................................................
31
3.2.15
Low-Power Modes
..............................................................................................
31
3.2.16
Peripheral Frames 0, 1, 2 (PFn)
..............................................................................
32
3.2.17
General-Purpose Input/Output (GPIO) Multiplexer
.........................................................
32
3.2.18
32-Bit CPU-Timers (0, 1, 2)
...................................................................................
32
3.2.19
Control Peripherals
.............................................................................................
32
3.2.20
Serial Port Peripherals
.........................................................................................
33
3.3
Register Map
................................................................................................................
33
3.4
Device Emulation Registers
...............................................................................................
36
3.5
Interrupts
....................................................................................................................
37
3.5.1
External Interrupts
..............................................................................................
39
3.6
System Control
.............................................................................................................
40
3.6.1
OSC and PLL Block
............................................................................................
41
3.6.2
Watchdog Block
.................................................................................................
44
3.7
Low-Power Modes Block
..................................................................................................
45
4
Peripherals
........................................................................................................................
46
4.1
32-Bit CPU-Timers 0/1/2
..................................................................................................
46
4.2
Enhanced PWM Modules (ePWM1/2/3/4/5/6)
..........................................................................
48
4.3
Hi-Resolution PWM (HRPWM)
...........................................................................................
50
4.4
Enhanced CAP Modules (eCAP1/2/3/4)
................................................................................
51
4.5
Enhanced QEP Modules (eQEP1/2)
.....................................................................................
53
4.6
Enhanced Analog-to-Digital Converter (ADC) Module
................................................................
55
4.7
Enhanced Controller Area Network (eCAN) Modules (eCAN-A and eCAN-B)
.....................................
60
4.8
Serial Communications Interface (SCI) Modules (SCI-A, SCI-B)
....................................................
65
4.9
Serial Peripheral Interface (SPI) Modules (SPI-A, SPI-B, SPI-C, SPI-D)
...........................................
68
4.10
Inter-Integrated Circuit (I
2
C)
...............................................................................................
72
4.11
GPIO MUX
..................................................................................................................
74
5
Device Support
..................................................................................................................
78
5.1
Device and Development Support Tool Nomenclature
................................................................
78
2
Contents
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TMS320VC5409GGU100 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Fixed-Pt Dig Signal Proc RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
TMS320VC5409GGU-80 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Fixed-Pt Dig Signal Proc RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
TMS320VC5409PGE100 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Fixed-Pt Dig Sig Proc RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
TMS320VC5409PGE100 制造商:Texas Instruments 功能描述:Digital Signal Processor IC
TMS320VC5409PGE-80 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC Fixed-Pt Dig Signal Proc RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
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