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參數(shù)資料
| 型號： | TOCP100X-100MB |
| 廠商： | Toshiba Corporation |
| 英文描述： | Optical Transmission Device |
| 中文描述： | 光傳輸設(shè)備 |
| 文件頁數(shù)： | 3/20頁 |
| 文件大?。?/td> | 1612K |
| 代理商： | TOCP100X-100MB |
3
Optical fiber Cable
Optical fiber cable consists of two parts. The center is called the core, the
outer layer is called the cladding. The refractive index of the core is higher
than that of the cladding. The effect of this arrangement is that when an
optical ray is propagated at an angle to the axis of the cable, it is reflected
back at the boundary between the core and the cladding, and thereby
transmitted longitudinally through the core.
There are three kinds of optical fiber:
a) All-plastic fiber (APF)
b) Plastic-cladding silica Fiber (PCF)
c) Silica fiber
APF is used for short-distance data transmission. Both the core and the
cladding are made of plastic. PCF, which is used for middle distance
transmission, has silica core and plastic cladding.Silica fiber is used for long-
distance transmission. Both the core and the cladding are made of silica.
TOSLINK circuit configuration
Construction of TOSLINK
Optical transmission module
The LED is driven by a differential circuit in the transmission module, making
it possible to decrease current fluctuation when the LED is either on or off.
For this reason, this module has no effect on other circuits around it.
Optical receiving module
An ATC (automatic threshold control) circuit is used to reshape the waveform
in the receiving module. The ATC circuit controls the comparator reference
voltage so that it is always automatically adjusted as the input optical power
changes. For this reason there will be little pulse width distortion even when
the length or degree of bending conditions of the optical fiber are changed.
There are two package types available for TOSLINK's internal optical units.
One is a molded resin package. It is used for ordinary applications. The
other is ceramic, used for applications requiring exceptionally high reliability.
The structure of the internal units of these two packages is shown in the
figure on the right. In the case of the molded resin type, the devices are
mounted on a lead frame and molded in with transparent resin.
In the ceramic package the devices are mounted on a ceramic substrate,
and hermetically sealed by a metal shell.
The ceramic package features better resistance against humidity and
temperature than the molded resin type.
Structure of optical fiber cable
Block diagram of transmission module
Block diagram of receiving module
Structure of internal units
Molded resin package
Ceramic package
Ceramic
Capacitor
Capacitor
Lead
Lead
Metallic
Bonding
Bonding
PD
PD
Receiving
IC
Receiving
IC
Resin
V
CC
GND
1
Output
GND
2
4
3
2
1
Amp circuit
ATC circuit
Reference voltage
generating circuit
Receiving IC
Comparator
V
CC
I
F
-CONT
Input
GND
Transmitting IC
4
3
2
1
LED
Optical ray
Sheathing
Cladding
Core
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TOSLINK | Optical Transmission Device |
| TODV1025 | CONNECTOR ACCESSORY |
| TODV1225 | CONNECTOR ACCESSORY |
| TODV625 | CONNECTOR ACCESSORY |
| TODV825 | CONNECTOR ACCESSORY |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TOCP100XK | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Fiber-Optic Devices Toslink |
| TOCP150QK | 制造商:Toshiba 功能描述:Bulk |
| TOCP150XK | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Fiber-Optic Devices Toslink |
| TOCP155K | 制造商:Toshiba America Electronic Components 功能描述:CERAMIC-PACKAGE TRANSCEIVING MODULE |
| TOCP155PK | 制造商:Toshiba 功能描述:Bulk |
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