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TOP242-250
33
N
4/05
Parameter
Symbol
Conditions
SOURCE = 0 V; T
J = -40 to 125 °C
See Figure 53
(Unless Otherwise Specied)
Min
Typ
Max
Units
CONTROL FUNCTIONS
Switching
Frequency
(average)
f
OSC
I
C = 3 mA;
T
J = 25 °C
FREQUENCY Pin
Connected to SOURCE
124
132
140
kHz
FREQUENCY Pin
Connected to CONTROL
61.5
66
70.5
Duty Cycle at
ONSET of
Frequency
Reduction
DC
(ONSET)
10
%
Switching
Frequency near
0% Duty Cycle
f
OSC(DMIN)
132 kHz Operation
30
kHz
66 kHz Operation
15
Frequency Jitter
Deviation
f
132 kHz Operation
±4
kHz
66 kHz Operation
±2
Frequency Jitter
Modulation Rate
f
M
250
Hz
ABSOLUTE MAXIMUM RATINGS(1,4)
DRAIN Voltage ..................................................-0.3Vto700V
DRAIN Peak Current: TOP242......................................0.72 A
TOP243.......................................1.44 A
TOP244..........................................2.16A
TOP245.......................................2.88 A
TOP246..........................................4.32 A
TOP247..........................................5.76 A
TOP248..........................................7.20 A
TOP249..........................................8.64 A
TOP250........................................10.08A
CONTROL Voltage ................................................ -0.3 V to 9
VCONTROLCurrent .................................................... 100 mA
LINE SENSE Pin Voltage ...................................-0.3 V to 9 V
CURRENT LIMIT Pin Voltage ........................-0.3 V to 4.5 V
MULTI-FUNCTION Pin Voltage ........................-0.3 V to 9 V
FREQUENCY Pin Voltage ..................................-0.3 V to 9 V
Storage Temperature ..................................... -65 °C to 150 °C
Operating Junction Temperature(2) ................ -40 °C to 150 °C
Lead Temperature(3) ...................................................... 260 °C
Notes:
1. All voltages referenced to SOURCE, T
A = 25 °C.
2. Normally limited by internal circuitry.
3. 1/16 in. from case for 5 seconds.
4. Maximum ratings specied may be applied one at a time,
without causing permanent damage to the product.
Exposure to Absolute Maximum Rating conditions for
extended periods of time may affect product reliability.
THERMAL IMPEDANCE
Thermal Impedance: Y or F Package:
(θ
JA)
(1)
...............................................80 °C/W
(θ
JC)
(2)
.................................................2 °C/W
P or G Package:
(θ
JA) ............................ 70 °C/W
(3)
; 60 °C/W(4)
(θ
JC)
(5)
................................................ 11 °C/W
R Package:
(θ
JA) ..........80 °C/W
(7)
; 40 °C/W(4); 30 °C/W(6)
(θ
JC)
(5)
..................................................2 °C/W
Notes:
1. Free standing with no heatsink.
2. Measured at the back surface of tab.
3. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2)
copper clad.
4. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad.
5. Measured on the SOURCE pin close to plastic interface.
6. Soldered to 3 sq. in. (1935 mm2), 2 oz. (610 g/m2) copper clad.
7. Soldered to foot print area, 2 oz. (610 g/m2) copper clad.