參數(shù)資料
型號： TPA005D02DCAR
廠商： TEXAS INSTRUMENTS INC
元件分類： 音頻／視頻放大
英文描述： 2 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO48
封裝： PLASTIC, HTSSOP-48
文件頁數(shù)： 21/25頁
文件大小： 373K
代理商： TPA005D02DCAR
TPA005D02
2-W STEREO CLASS-D AUDIO POWER AMPLIFIER
SLOS227C – AUGUST 1998 – REVISED MARCH 2000
5
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
recommended operating conditions
MIN
NOM
MAX
UNIT
Supply voltage, PVDD, LPVDD, RPVDD, VDD
4.5
5.5
V
High-level input voltage, VIH
4.25
V
Low-level input voltage, VIL
0.75
V
Audio inputs, LINN, LINP, RINN, RINP, HPLIN, HPRIN, differential input voltage
1
VRMS
PWM frequency
100
500
kHZ
electrical characteristics, VDD = PVDD = LPVDD = RPVDD = 5 V, RL = 4 , TC = 25°C, See Figure 1
(resistive load) (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
PSRR
Power supply rejection ratio
VDD = PVDD = LPVDD = RPVDD = 4.9 V to 5.1 V
40
dB
IDD
Supply current
No load or output filter
25
40
mA
IDD(MUTE) Supply current, mute mode
MUTE = 0 V
10
15
mA
IDD(SD)
Supply current, shutdown mode
SHUTDOWN = 0 V
400
2000
A
IIH
High-level input current
VIH = 5.3 V
10
A
IIL
Low-level input current
VIL = – 0.3 V
–10
A
rDS(on)
Total static drain-to-source
on-state resistance
(low-side plus high-side FETs)
ID = 0.5 A
620
750
m
rDS(on)
Matching
95%
99.5%
operating characteristics, VDD = PVDD = LPVDD = RPVDD = 5 V, RL = 4 , TC = 25°C, See Figure 1
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
PO
RMS output power, THD = 0.5%, per channel
2
W
THD+N
Total harmonic distortion plus noise
PO = 1 W, f = 1 kHz
0.2%
Efficiency
RL = 8
80%
AV
Gain
24
dB
Left/right channel gain matching
95%
Noise floor
60
dB
Dynamic range
70
dB
Crosstalk
f = 1 kHz
55
dB
Frequency response bandwidth, post output filter, – 3 dB
20
20,000
Hz
BOM
Maximum output power bandwidth
20
kHz
thermal resistance
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
R
θJP
Thermal resistance, junction-to-pad
10
°C/W
R
θJA
Thermal resistance, junction-to-pad
22.3
°C/W
Please see the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report (literature number SLMA002), for
more information on the PowerPAD package. The thermal data was measured on a PCB layout based on the information in the section entitled
Texas Instruments Recommended Board for PowerPAD on page 33 of the before mentioned document.
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