VO VO+ Internal Oscillator
參數(shù)資料
型號(hào): TPA2035D1YZFT
廠商: Texas Instruments
文件頁(yè)數(shù): 4/18頁(yè)
文件大?。?/td> 0K
描述: IC AMP AUDIO PWR 2.75W D 9DSBGA
標(biāo)準(zhǔn)包裝: 250
系列: NanoFree™
類型: D 類
輸出類型: 1-通道(單聲道)
在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量: 2.75W x 1 @ 4 歐姆
電源電壓: 2.5 V ~ 5.5 V
特點(diǎn): 消除爆音,差分輸入,短路和熱保護(hù),關(guān)閉
安裝類型: 表面貼裝
供應(yīng)商設(shè)備封裝: 9-DSBGA(1.8x1.8)
封裝/外殼: 9-UFBGA,DSBGA
包裝: 帶卷 (TR)
其它名稱: 296-32455-2
TPA2035D1YZFT-ND
_
+
IN
IN+
PWM
H
Bridge
VO
VO+
Internal
Oscillator
CS
ToBattery
VDD
GND
Bias
Circuitry
Single-ended
Input
TPA2035D1
Filter-FreeClassD
SHUTDOWN
CI
BOARD LAYOUT
Copper
Trace Width
Solder Mask
Thickness
Solder
Pad Width
Solder Mask
Opening
Copper Trace
Thickness
SLOS562 – AUGUST 2008 ................................................................................................................................................................................................ www.ti.com
Figure 31. TPA2035D1 Application Schematic With Single-Ended Input
In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 32 and Table 1 show the appropriate diameters for a
WCSP layout. The TPA2035D1 evaluation module (EVM) layout is shown in the next section as a layout
example.
Figure 32. Land Pattern Dimensions
12
Copyright 2008, Texas Instruments Incorporated
Product Folder Link(s): TPA2035D1
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