參數(shù)資料
型號： TPA3008D2PHPR
廠商： TEXAS INSTRUMENTS INC
元件分類： 音頻／視頻放大
英文描述： 10 W, 2 CHANNEL, AUDIO AMPLIFIER, PQFP48
封裝： GREEN, PLASTIC, HTQFP-48
文件頁數(shù)： 12/31頁
文件大小： 654K
代理商： TPA3008D2PHPR
SLOS435C – MAY 2004 – REVISED AUGUST 2010
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OPTIONS
PACKAGED DEVICE
TA
48-PIN HTQFP (PHP)(1) (2)
-40°C to 85°C
TPA3008D2PHP
(1)
The PHP package is available taped and reeled. To order a taped and reeled part, add the suffix R to the part number (e.g.,
TPA3008D2PHPR).
(2)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
TPA3008D2
Supply voltage range
AVCC, PVCC
-0.3 V to 20 V
Load Impedance, RL
≥ 6
SHUTDOWN
-0.3 V to VCC + 0.3 V
Input voltage range, VI
GAIN0, GAIN1, RINN, RINP, LINN, LINP
-0.3 V to 6 V
Continuous total power dissipation
See Thermal Information Table
Operating free–air temperature range, TA
- 40°C to 85°C
Operating junction temperature range, TJ
- 40°C to 150°C
Storage temperature range, Tstg
- 65°C to 150°C
(1)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
TPA3008D2
THERMAL METRIC(1) (2)
UNITS
PHP (48 PINS)
qJA
Junction-to-ambient thermal resistance
27.7
qJCtop
Junction-to-case (top) thermal resistance
14.8
qJB
Junction-to-board thermal resistance
9.4
°C/W
yJT
Junction-to-top characterization parameter
0.6
yJB
Junction-to-board characterization parameter
5.6
qJCbot
Junction-to-case (bottom) thermal resistance
0.3
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.
RECOMMENDED OPERATING CONDITIONS
TA = 25°C (unless otherwise noted)
MIN
MAX
UNIT
Supply voltage, VCC
PVCC, AVCC
8.5
18
V
High-level input voltage, VIH
SHUTDOWN, GAIN0, GAIN1
2
V
Low-level input voltage, VIL
SHUTDOWN, GAIN0, GAIN1
0.8
V
SHUTDOWN, VI = VCC = 18 V
10
A
High-level input current, IIH
GAIN0, GAIN1, VI = 5.5 V, VCC = 18 V
1
A
SHUTDOWN, VI = 0 V, VCC = 18 V
1
A
Low-level input current, IIL
GAIN0, GAIN1, VI = 5.5 V, VCC = 18 V
1
A
High-level output voltage, VOH
FAULT, IOH = 100 A
AVDD - 0.8 V
V
Low-level output voltage, VOL
FAULT, IOL = -100 A
AGND + 0.8 V
V
2
Copyright 2004–2010, Texas Instruments Incorporated
Product Folder Link(s): TPA3008D2
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