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參數(shù)資料
| 型號(hào)： | TPA6135A2RTER |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 0.025 W, 2 CHANNEL, AUDIO AMPLIFIER, PQCC16 |
| 封裝： | 3 X 3 MM, PLASTIC, QFN-16 |
| 文件頁數(shù)： | 8/23頁 |
| 文件大?。?/td> | 948K |
| 代理商： | TPA6135A2RTER |
POWER SUPPLY AND HPVDD DECOUPLING CAPACITORS AND CONNECTIONS
LAYOUT RECOMMENDATIONS
EXPOSED PAD ON TPA6135A2RTE
GND CONNECTIONS
SLOS623A – FEBRUARY 2009 – REVISED APRIL 2009 .................................................................................................................................................. www.ti.com
The TPA6135A2 DirectPath headphone amplifier requires adequate power supply decoupling to ensure that
output noise and total harmonic distortion (THD) remain low. Use good low equivalent-series-resistance (ESR)
ceramic capacitors (X5R material or better is required for best performance). Place a 2.2
F capacitor within
5 mm of the VDD pin. Reducing the distance between the decoupling capacitor and VDD minimizes parasitic
inductance and resistance, improving TPA6135A2 supply rejection performance. Use 0402 or smaller size
capacitors if possible. Ensure that the ground connection of each of the capacitors has a minimum length return
path to the device. Failure to properly decouple the TPA6135A2 may degrade audio or EMC performance.
For additional supply rejection, connect an additional 10
F or higher value capacitor between VDD and ground.
This will help filter lower frequency power supply noise. The high power supply rejection ratio (PSRR) of the
TPA6135A2 makes the 10
F capacitor unnecessary in most applications.
Connect a 2.2
F capacitor between HPVDD and ground. This ensures the amplifier internal bias supply remains
stable and maximizes headphone amplifier performance.
WARNING:
DO NOT connect HPVDD directly to VDD or an external supply voltage. The
voltage at HPVDD is generated internally. Connecting HPVDD to an external
voltage can damage the device.
Solder the exposed metal pad on the TPA6135A2RTE QFN package to the landing pad on the PCB. Connect
the landing pad to ground or leave it electrically unconnected (floating). Do not connect the landing pad to VDD
or to any other power supply voltage.
If the pad is grounded, it must be connected to the same ground as the PGND pin (10). See the layout and
mechanical drawings at the end of the data sheet for proper sizing. Soldering the thermal pad is required for
mechanical reliability and enhances thermal conductivity of the package.
WARNING:
DO NOT connect the TPA6135A2RTE exposed metal pad to VDD or any other
power supply voltage.
The SGND pin is an input reference and must be connected to the headphone ground connector pin. This
ensures no turn-on pop and minimizes output offset voltage. Do not connect more than ±0.3 V to SGND.
PGND is a power ground. Connect supply decoupling capacitors for VDD, HPVDD, and HPVSS to PGND.
16
Copyright 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA6135A2
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TPA6135A2RTET | 功能描述:音頻放大器 25mW DirectPath St Headphone Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| TPA6135A2RTET | 制造商:Texas Instruments 功能描述:Audio Power Amplifiers TI |
| TPA6136A2 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:25-mW DIRECTPATH STEREO HEADPHONE AMPLIFIER WITH POP SUPPRESSION |
| TPA6136A2YFFEVM | 功能描述:音頻 IC 開發(fā)工具 TPA6136A2YFF Eval Mod RoHS:否 制造商:Texas Instruments 產(chǎn)品:Evaluation Kits 類型:Audio Amplifiers 工具用于評(píng)估:TAS5614L 工作電源電壓:12 V to 38 V |
| TPA6136A2YFFR | 功能描述:音頻放大器 25mW DirectPath St Headphone Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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