TPA711
700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER
SLOS230C
–
NOVEMBER 1998
–
REVISED APRIL 2001
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
AVAILABLE OPTIONS
PACKAGED DEVICES
SMALL OUTLINE
(D)
MSOP
TA
MSOP
(DGN)
SYMBOLIZATION
–
40
°
C to 85
°
C
In the SOIC package, the maximum RMS output power is thermally limited to 350 mW; 700 mW
peaks can be driven, as long as the RMS value is less than 350 mW.
The D and DGN packages are available taped and reeled. To order a taped and reeled part, add
the suffix R to the part number (e.g., TPA311DR).
TPA711D
TPA711DGN
ABB
Terminal Functions
TERMINAL
NAME
I/O
DESCRIPTION
NO.
BYPASS
2
I
BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be connected to
a 0.1-
μ
F to 2.2-
μ
F capacitor when used as an audio amplifier.
GND
7
GND is the ground connection.
IN
4
I
IN is the audio input terminal.
SE/BTL
3
I
When SE/BTL is held low, the TPA711 is in BTL mode. When SE/BTL is held high, the TPA711 is in SE mode.
SHUTDOWN places the entire device in shutdown mode when held high (IDD = 7
μ
A).
VDD is the supply voltage terminal.
VO+ is the positive output for BTL and SE modes.
VO
–
is the negative output in BTL mode and a high-impedance output in SE mode.
SHUTDOWN
1
I
VDD
VO+
VO
–
6
5
O
8
O
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
§
Supply voltage, V
DD
Input voltage, V
I
Continuous total power dissipation
Operating free-air temperature range, T
A
(see Table 3)
Operating junction temperature range, T
J
Storage temperature range, T
stg
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
internally limited (see Dissipation Rating Table)
. . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–
0.3 V to V
DD
+0.3 V
–
40
°
C to 85
°
C
–
40
°
C to 150
°
C
–
65
°
C to 150
°
C
260
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
§
Stresses beyond those listed under
“
absolute maximum ratings
”
may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under
“
recommended operating conditions
”
is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
TA
≤
25
°
C
725 mW
2.14 W
DERATING FACTOR
5.8 mW/
°
C
TA = 70
°
C
464 mW
TA = 85
°
C
377 mW
D
DGN
17.1 mW/
°
C
1.37 W
1.11 W
Please see the Texas Instruments document,
PowerPAD Thermally Enhanced Package Application Report
(literature number SLMA002), for more information on the PowerPAD package. The thermal data was
measured on a PCB layout based on the information in the section entitled
Texas Instruments Recommended
Board for PowerPAD
on page 33 of the before mentioned document.
recommended operating conditions
MIN
MAX
UNIT
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Operating free-air temperature, TA (see Table 3)
2.5
5.5
V
°
C
–
40
85