TPA711
700mW MONO LOW VOLTAGE AUDIO POWER AMPLIFIER
SLOS230D NOVEMBER 1998 REVISED OCTOBER 2002
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Fully Specified for 3.3-V and 5-V Operation
D Wide Power Supply Compatibility
2.5 V 5.5 V
D Output Power
700 mW at VDD = 5 V, BTL, RL = 8
85 mW at VDD = 5 V, SE, RL = 32
250 mW at VDD = 3.3 V, BTL, RL = 8
37 mW at VDD = 3.3 V, SE, RL = 32
D Shutdown Control
IDD = 7 A at 3.3 V
IDD = 50 A at 5 V
D BTL to SE Mode Control
D Integrated Depop Circuitry
D Thermal and Short-Circuit Protection
SOIC
PowerPAD
MSOP
description
The TPA711 is a bridge-tied load (BTL) or
single-ended (SE) audio power amplifier devel-
oped especially for low-voltage applications where internal speakers and external earphone operation are
required. Operating with a 3.3-V supply, the TPA711 can deliver 250-mW of continuous power into a BTL 8-
load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out
to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL
configuration eliminates the need for external coupling capacitors on the output in most applications, which is
particularly important for small battery-powered equipment. A unique feature of the TPA711 is that it allows the
amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated
mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode
for power-sensitive applications with special depop circuitry to eliminate speaker noise when exiting shutdown
mode. The TPA711 is available in an 8-pin SOIC and the surface-mount PowerPAD MSOP package, which
reduces board space by 50% and height by 40%.
Audio
Input
Bias
Control
VDD
700 mW
6
5
7
VO+
VDD
3
1
2
4
BYPASS
IN
SE/BTL
VDD/2
CI
RI
CS
CB
RF
SHUTDOWN
From HP Jack
VO8
GND
From System Control
+
+
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright
2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
2
3
4
8
7
6
5
SHUTDOWN
BYPASS
SE/BTL
IN
VO
GND
VDD
VO+
D OR DGN PACKAGE
(TOP VIEW)
PowerPAD is a trademark of Texas Instruments.