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參數(shù)資料
| 型號： | TPS54331DG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 2 A SWITCHING REGULATOR, 684 kHz SWITCHING FREQ-MAX, PDSO8 |
| 封裝： | GREEN, PLASTIC, MS-012AA, SOIC-8 |
| 文件頁數(shù)： | 9/27頁 |
| 文件大?。?/td> | 794K |
| 代理商： | TPS54331DG4 |
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www.ti.com
SLVS839C – JULY 2008 – REVISED MARCH 2010
Where:
Ptot is the total device power dissipation (W).
TA is the ambient temperature (°C).
TJ is the junction temperature (°C) .
Rth is the thermal resistance of the package (°C/W).
TJMAX is maximum junction temperature (°C).
TAMAX is maximum ambient temperature (°C).
PCB LAYOUT
The VIN pin should be bypassed to ground with a low ESR ceramic bypass capacitor. Care should be taken to
minimize the loop area formed by the bypass capacitor connections, the VIN pin, and the anode of the catch
diode. The typical recommended bypass capacitance is 10-mF ceramic with a X5R or X7R dielectric and the
optimum placement is closest to the VIN pins and the source of the anode of the catch diode. See Figure 14 for
a PCB layout example. The GND D pin should be tied to the PCB ground plane at the pin of the IC. The source
of the low-side MOSFET should be connected directly to the top side PCB ground area used to tie together the
ground sides of the input and output capacitors as well as the anode of the catch diode. The PH pin should be
routed to the cathode of the catch diode and to the output inductor. Since the PH connection is the switching
node, the catch diode and output inductor should be located very close to the PH pins, and the area of the PCB
conductor minimized to prevent excessive capacitive coupling. For operation at full rated load, the top side
ground area must provide adequate heat dissipating area. The TPS54331 uses a fused lead frame so that the
GND pin acts as a conductive path for heat dissipation from the die. Many applications have larger areas of
internal or back side ground plane available, and the top side ground area can be connected to these areas
using multiple vias under or adjacent to the device to help dissipate heat. The additional external components
can be placed approximately as shown. It may be possible to obtain acceptable performance with alternate
layout schemes, however this layout has been shown to produce good results and is intended as a guideline.
Copyright 2008–2010, Texas Instruments Incorporated
17
Product Folder Link(s): TPS54331
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TPS54331DR | 功能描述:直流/直流開關(guān)轉(zhuǎn)換器 3A 28V In Step Down SWIFT DC/DC Cnvrtr RoHS:否 制造商:STMicroelectronics 最大輸入電壓:4.5 V 開關(guān)頻率:1.5 MHz 輸出電壓:4.6 V 輸出電流:250 mA 輸出端數(shù)量:2 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT |
| TPS54331DRG4 | 功能描述:直流/直流開關(guān)轉(zhuǎn)換器 26V,3A DC-DC Converter RoHS:否 制造商:STMicroelectronics 最大輸入電壓:4.5 V 開關(guān)頻率:1.5 MHz 輸出電壓:4.6 V 輸出電流:250 mA 輸出端數(shù)量:2 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT |
| TPS54331DR-P | 制造商:Rochester Electronics LLC 功能描述: 制造商:Texas Instruments 功能描述: |
| TPS54331EVM-232 | 功能描述:電源管理IC開發(fā)工具 SWIFT Cnvrtr Eval Mod RoHS:否 制造商:Maxim Integrated 產(chǎn)品:Evaluation Kits 類型:Battery Management 工具用于評估:MAX17710GB 輸入電壓: 輸出電壓:1.8 V |
| TPS54331EVM-232 | 制造商:Texas Instruments 功能描述:DEVELOPMENT TOOL |
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