ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
(1)
SLVS678 – JUNE 2008 ...................................................................................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION(1)
PACKAGE
PART
OUTPUT
TA
PACKAGE
ORDERING(2)(3)
MARKING
NUMBER
VOLTAGE
CHIP CODE
TPS62600
1.83V
TPS62600YFF
G9
-40°C to 85°C
YFF-6
TPS62601
1.8V
TPS62601YFF
GA
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
(2)
The YFF package is available in tape and reel. Add a R suffix (TPS62600YFFR) to order quantities of 3000 parts. Add a T suffix
(TPS62600YFFT) to order quantities of 250 parts.
(3)
Internal tap points are available to facilitate output voltages in 25mV increments.
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
Voltage at VIN, SW(2)
-0.3 V to 7 V
VI
Voltage at FB(2)
-0.3 V to 3.6 V
Voltage at EN, MODE (2)
-0.3 V to VI + 0.3 V
Power dissipation
Internally limited
TA
Operating temperature range(3)
-40°C to 85°C
TJ (max)
Maximum operating junction temperature
150°C
Tstg
Storage temperature range
-65°C to 150°C
Human body model
2 kV
ESD rating (4)
Charge device model
1 kV
Machine model
200 V
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
(3)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the
maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package
in the application (
θ
JA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)).
(4)
The human body model is a 100-pF capacitor discharged through a 1.5-k
resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
POWER RATING
DERATING FACTOR
PACKAGE
RθJA
(2)
RθJB
(2)
TA ≤ 25°C
ABOVE TA = 25°C
YFF-6
125°C/W
53°C/W
800mW
8mW/°C
(1)
Maximum power dissipation is a function of TJ(max), θJA and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = [TJ(max)-TA] / θJA.
(2)
This thermal data is measured with high-K board (4 layers board according to JESD51-7 JEDEC standard).
2
Copyright 2008, Texas Instruments Incorporated