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參數(shù)資料
| 型號： | TPS62691YFFT |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 0.6 A SWITCHING REGULATOR, 4400 kHz SWITCHING FREQ-MAX, BGA6 |
| 封裝： | DSBGA-6 |
| 文件頁數(shù)： | 14/27頁 |
| 文件大?。?/td> | 870K |
| 代理商： | TPS62691YFFT |
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MODE
ENABLE
C
I
L
V
IN
C
O
V
OUT
GND
J(MAX)
A
D(MAX)
JA
T
- T
105 C - 85 C
P
=
= 160mW
R
125 C/W
q
°
SLVS965
– MARCH 2011
LAYOUT CONSIDERATIONS
As for all switching power supplies, the layout is an important step in the design. High-speed operation of the
TPS6269x devices demand careful attention to PCB layout. Care must be taken in board layout to get the
specified performance. If the layout is not carefully done, the regulator could show poor line and/or load
regulation, stability and switching frequency issues as well as EMI problems. It is critical to provide a low
inductance, impedance ground path. Therefore, use wide and short traces for the main current paths.
The input capacitor should be placed as close as possible to the IC pins as well as the inductor and output
capacitor. In order to get an optimum ESL step, the output voltage feedback point (FB) should be taken in the
output capacitor path, approximately 1mm away for it. The feed-back line should be routed away from noisy
components and traces (e.g. SW line).
Figure 36. Suggested Layout (Top)
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependant issues such as thermal coupling, airflow, added
heat sinks, and convection surfaces, and the presence of other heat-generating components, affect the
power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below:
Improving the power dissipation capability of the PCB design
Improving the thermal coupling of the component to the PCB
Introducing airflow into the system
The maximum recommended junction temperature (TJ) of the TPS6269x devices is 105°C. The thermal
resistance of the 6-pin CSP package (YFF-6) is RθJA = 125°C/W. Regulator operation is specified to a maximum
steady-state ambient temperature TA of 85°C. Therefore, the maximum power dissipation is about 160 mW.
(3)
2011, Texas Instruments Incorporated
21
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