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| 型號： | TPS72525KTT |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | LOW INPUT VOLTAGE, 1-A LOW-DROPOUT LINEAR REGULATORS WITH SUPERVISOR |
| 中文描述： | 低輸入電壓，1低壓差線性穩(wěn)壓器與督導(dǎo)員 |
| 文件頁數(shù)： | 3/18頁 |
| 文件大?。?/td> | 535K |
| 代理商： | TPS72525KTT |
www.ti.com
A
B
C
TJ
A
RθJC
TC
B
RθCS
TA
C
RθSA
(a)
(b)
DDPAK Package
SOT223 Package
CIRCUIT BOARD COPPER AREA
B
A
C
T
J +
T
A )
P
Dmax x R
θJC ) RθCS ) RθSA
(4)
T
J +
T
A )
P
Dmax x R
θJA
(5)
RθJA +
T
J–TA
P
Dmax
(6)
DDPAK Power Dissipation
TPS72501
TPS72515, TPS72516
TPS72518, TPS72525
SLVS341D – MAY 2002 – REVISED MARCH 2004
THERMAL INFORMATION (continued)
Figure 20. Thermal Resistances
Equation 4 summarizes the computation:
The RθJC is specific to each regulator as determined by its package, lead frame, and die size provided in the
regulator's data sheet. The RθSA is a function of the type and size of heatsink. For example, black body radiator
type heatsinks can have RθCS values ranging from 5°C/W for very large heatsinks to 50°C/W for very small
heatsinks. The RθCS is a function of how the package is attached to the heatsink. For example, if a thermal
compound is used to attach a heatsink to a SOT223 package, RθCSof 1°C/W is reasonable.
Even if no external black body radiator type heatsink is attached to the package, the board on which the
regulator is mounted provides some heatsinking through the pin solder connections. Some packages, like the
DDPAK and SOT223 packages, use a copper plane underneath the package or the circuit board's ground plane
for additional heatsinking to improve their thermal performance. Computer-aided thermal modeling can be used
to compute very accurate approximations of an integrated circuit's thermal performance in different operating
environments (e.g., different types of circuit boards, different types and sizes of heatsinks, different air flows,
etc.). Using these models, the three thermal resistances can be combined into one thermal resistance between
junction and ambient (RθJA). This RθJAis valid only for the specific operating environment used in the computer
model.
Equation 4 simplifies into Equation 5:
Rearranging Equation 5 gives Equation 6:
Using Equation 5 and the computer model generated curves shown in Figure 21 and Figure 24, a designer can
quickly compute the required heatsink thermal resistance/board area for a given ambient temperature, power
dissipation, and operating environment.
The DDPAK package provides an effective means of managing power dissipation in surface mount applications.
The DDPAK package dimensions are provided in the Mechanical Data section at the end of the data sheet. The
addition of a copper plane directly underneath the DDPAK package enhances the thermal performance of the
package.
11
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| TPS72525KTTR | 功能描述:低壓差穩(wěn)壓器 - LDO Low Input Voltage Any Cap 1-A RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS72525KTTRG3 | 功能描述:低壓差穩(wěn)壓器 - LDO Low Input Voltage Any Cap 1-A RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS72525KTTT | 功能描述:低壓差穩(wěn)壓器 - LDO Low Input Voltage Any Cap 1-A RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS72525KTTTG3 | 功能描述:低壓差穩(wěn)壓器 - LDO Low Input Voltage Any Cap 1-A RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS726126DCQ | 功能描述:低壓差穩(wěn)壓器 - LDO Low Input Voltage Any Cap 1A RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
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