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參數(shù)資料
| 型號(hào)： | TS1874IYPT |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | 1.8V input/output rail-to-rail Low power operational amplifiers |
| 中文描述： | 1.8V的輸入/輸出軌至軌運(yùn)算放大器，低功耗 |
| 文件頁(yè)數(shù)： | 16/27頁(yè) |
| 文件大小： | 325K |
| 代理商： | TS1874IYPT |
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Package mechanical data
TS1871-TS1872-TS1874
16/27
3
Package mechanical data
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK
packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at:
www.st.com
.
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