參數(shù)資料
型號(hào)： TS4998IQT
廠商： STMICROELECTRONICS
元件分類： 音頻／視頻放大
英文描述： 1 W, 2 CHANNEL, AUDIO AMPLIFIER, QCC16
封裝： 4 X 4 MM, ROHS COMPLIANT, QFN-16
文件頁(yè)數(shù)： 18/33頁(yè)
文件大小： 488K
代理商： TS4998IQT
TS4998
Application information
25/33
4.7
Footprint recommendation
Footprint soldering pad dimensions are given in Figure 72 on page 30. As discussed in the
previous section, the maximum allowable value for ambient temperature is dependent on
the thermal resistance junction to ambient RTHJA. Decreasing the RTHJA value causes better
power dissipation.
Based on best thermal performance, it is recommended to use 4-layer PCBs with vias to
effectively remove heat from the device. It is also recommended to use vias for 2-layer PCBs
to connect the package exposed pad to heatsink cooper areas placed on another layer.
For proper thermal conductivity, the vias must be plated through and solder-filled. Typical
thermal vias have the following dimensions: 1.2mm pitch, 0.3mm diameter.
Figure 65.
QFN16 footprint recommendation
4.8
Decoupling of the circuit
Two capacitors are needed to correctly bypass the TS4998: a power supply bypass
capacitor CS and a bias voltage bypass capacitor Cb.
The CS capacitor has particular influence on the THD+N at high frequencies (above 7kHz)
and an indirect influence on power supply disturbances. With a value for CS of 1F, one can
expect THD+N performance similar to that shown in the datasheet.
In the high frequency region, if CS is lower than 1F, then THD+N increases and
disturbances on the power supply rail are less filtered.
On the other hand, if CS is greater than 1F, then those disturbances on the power supply
rail are more filtered.
The Cb capacitor has an influence on the THD+N at lower frequencies, but also impacts
PSRR performance (with grounded input and in the lower frequency region).
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