參數(shù)資料
型號(hào)： TS8388BVF
元件分類： ADC
英文描述： 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68
封裝： CERAMIC, QFP-68
文件頁(yè)數(shù)： 7/44頁(yè)
文件大?。?/td> 850K
代理商： TS8388BVF
15
Preliminary Beta-Site
Specification
TS8388BF
4.4.
THERMAL CHARACTERISTICS
Although the power dissipation is low for this performance, the use of a heat sink is mandatory.
You will find here below some advise on this topics.
4.4.1.
THERMAL RESISTANCE FROM JUNCTION TO AMBIENT : RTHJA
The following table lists the convertor thermal performance parameters, with or without heatsink.
For the following measurements, a 50 x 50 x 16 mm heatsink has been used. (see drawing in part 4.4.3.)
Air flow
Estimated
Targeted
(m/s)
Without heatsink
With heatsink
0
50
10
0,5
40
8,9
1
35
7,9
1,5
32
7,3
2
30
6,8
2,5
28
6,5
3
26
6,2
4
24
5,8
5
23,5
5,6
Heatsink glued to backside of
package or screwed and
pressed with thermal grease
ja thermal resistance (
oC / W)
CQFP68 on board
0
10
20
30
40
50
60
0
1
2
3
4
5
Air flow (m/s)
Rthja
(deg/W)
Without heatsink
With heatsink
4.4.2.
THERMAL RESISTANCE FROM JUNCTION TO CASE : RTHJC
Typical value for Rthjc is given to 4.75
oC/W.
4.4.3.
CQFP68 BOARD ASSEMBLY WITH A 50 X 50 X 16 MM EXTERNAL HEATSINK
24.13
28.96
15.0
1.3
3.2
50.0
1.4
4.0
2.5
16.0
Printed circuit board
Interface : Af-filled epoxy or thermal
conductive grease – 100
m max.
Aluminum
heatsink
相關(guān)PDF資料
PDF描述
TS8388BMFB/Q 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68
TS8388BMF 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQFP68
TS8388BCG 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CBGA72
TS8388BCG 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CBGA72
TS8388BCG 1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CBGA72
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