參數(shù)資料
型號： TSA5059AT
廠商： NXP SEMICONDUCTORS
元件分類： XO, clock
英文描述： RES,Wirewound,100Ohms,400WV,5+/-% Tol,200ppm-TC,6350-Case
中文描述： PLL FREQUENCY SYNTHESIZER, 2700 MHz, PDSO16
封裝： 3.90 MM, PLASTIC, MS-012, SOT-109-1, SOP-16
文件頁數(shù)： 21/24頁
文件大?。?/td> 118K
代理商： TSA5059AT
2000 Oct 24
21
Philips Semiconductors
Product specification
2.7 GHz I
2
C-bus controlled low phase
noise frequency synthesizer
TSA5059A
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
相關(guān)PDF資料
PDF描述
TSA5059ATS 2.7 GHz I2C-bus controlled low phase noise frequency synthesizer
TSA5059TS 2.7 GHz I2C-bus controlled low phase noise frequency synthesizer
TSA5059 2.7 GHz I2C-bus controlled low phase noise frequency synthesizer
TSA5059T 2.7 GHz I2C-bus controlled low phase noise frequency synthesizer
TSC2200 PDA ANALOG INTERFACE CIRCUIT
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TSA5059AT/C2,518 制造商:NXP Semiconductors 功能描述:
TSA5059ATS 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2.7 GHz I2C-bus controlled low phase noise frequency synthesizer
TSA5059ATS/C1,118 功能描述:鎖相環(huán) - PLL 2,7GHZI2C BUS RoHS:否 制造商:Silicon Labs 類型:PLL Clock Multiplier 電路數(shù)量:1 最大輸入頻率:710 MHz 最小輸入頻率:0.002 MHz 輸出頻率范圍:0.002 MHz to 808 MHz 電源電壓-最大:3.63 V 電源電壓-最小:1.71 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:QFN-36 封裝:Tray
TSA5059ATS/C2,118 制造商:NXP Semiconductors 功能描述:
TSA5059T 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2.7 GHz I2C-bus controlled low phase noise frequency synthesizer
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