參數(shù)資料
型號(hào): TSC2200IRHB
英文描述: PDA ANALOG INTERFACE CIRCUIT
中文描述: 掌上電腦模擬接口電路
文件頁數(shù): 36/40頁
文件大?。?/td> 645K
代理商: TSC2200IRHB
36
www.ti.com
TSC2200
SBAS191F
THERMAL INFORMATION
The RHB package incorporates an exposed thermal die pad
that is designed to be attached directly to an external heat
sink. When the thermal die pad is soldered directly to the
printed circuit board (PCB), the PCB can be used as a heat
sink. In addition, through the use of thermal vias, the thermal
die pad can be attached directly to a ground plane or special
heat sink structure designed into the PCB. This design
optimizes the heat transfer from the integrated circuit (IC).
See Figure 31 for RHB package exposed thermal die pad
dimensions.
FIGURE 31. RHB Package Exposed Thermal Die Pad Dimensions.
25
16
32
9
24
1
17
8
Exposed Thermal
Die Pad
Bottom View
QFND013
NOTE: All linear dimensions are in millimeters.
3,55
3,35
3,55
3,35
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