參數(shù)資料
型號(hào): TSC83251G2D-16CB
廠商: Atmel Corp.
英文描述: B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES
中文描述: B/16-BIT微控制器串行通信接口
文件頁(yè)數(shù): 24/28頁(yè)
文件大小: 153K
代理商: TSC83251G2D-16CB
Qualpack TSC87251G2D
24 Rev 0 – October 1999
4. User Information
4.1 Soldering Recommendations
For DRY PACKED products,
TEMIC recommends to strictly follow the procedure described
hereunder:
- Dry packed products must not be stored more than 1 year at 40°c - 90%rh
(worst storage conditions assumed)
- A longer storage period is allowed taking into account the following conditions:
5 years max at 25°c (+/-5°c) - 50%rh
- From opening of the packs, the product must be assembled within 48 hours.
(worst in-process storage condition assumed: 30°c - 60%rh)
- If they cannot be soldered within this time period, then the pieces must be dryed at
125°c for 24 hours. Only one drying is allowed.
- Max relative humidity allowed in the bag is 20% (readable on the indicator inside
the bag). If this value is reached, then the parts must be dryed at 125°C for
24 hours before mounting.
- For high sensitive products, the delay between pack openning and assembly is
reduced to 6 hours (Level 6 of JEDEC 22-A112). In this case, a warning printed on
each pack advises the user of this restriction.
4.2 DRY PACK Ordering rules
TEMIC qualification procedure allows to classify products according to JEDEC 22-A112 and to
determine the convenient conditioning for safe customer use.
Nevertheless, even if the product is not classified as moisture sensitive, it is possible (for example if
storage conditions are not properly controlled) to order product with a Dry Pack.
4.3 ESD caution
The user must protect components against EOS and ESD damages by grounding personal and
workstations.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TSC87251 制造商: 功能描述: 制造商:undefined 功能描述:
TSC87251G2D-16CB 功能描述:IC MCU 8BIT 32K OTP 16MHZ 44PLCC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:8x251 標(biāo)準(zhǔn)包裝:9 系列:87C 核心處理器:8051 芯體尺寸:8-位 速度:40/20MHz 連通性:UART/USART 外圍設(shè)備:POR,WDT 輸入/輸出數(shù):32 程序存儲(chǔ)器容量:32KB(32K x 8) 程序存儲(chǔ)器類型:OTP EEPROM 大小:- RAM 容量:256 x 8 電壓 - 電源 (Vcc/Vdd):4.5 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:0°C ~ 70°C 封裝/外殼:40-DIP(0.600",15.24mm) 包裝:管件
TSC87251G2D-16CBR 功能描述:IC MCU 8BIT 32K OTP 16MHZ 44PLCC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:8x251 標(biāo)準(zhǔn)包裝:1,500 系列:AVR® ATtiny 核心處理器:AVR 芯體尺寸:8-位 速度:16MHz 連通性:I²C,LIN,SPI,UART/USART,USI 外圍設(shè)備:欠壓檢測(cè)/復(fù)位,POR,PWM,溫度傳感器,WDT 輸入/輸出數(shù):16 程序存儲(chǔ)器容量:8KB(4K x 16) 程序存儲(chǔ)器類型:閃存 EEPROM 大小:512 x 8 RAM 容量:512 x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 11x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:20-SOIC(0.295",7.50mm 寬) 包裝:帶卷 (TR)
TSC87251G2D-24CB 功能描述:IC C251 MCU OTPROM 32K 44PLCC RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:8x251 標(biāo)準(zhǔn)包裝:1,500 系列:AVR® ATtiny 核心處理器:AVR 芯體尺寸:8-位 速度:16MHz 連通性:I²C,LIN,SPI,UART/USART,USI 外圍設(shè)備:欠壓檢測(cè)/復(fù)位,POR,PWM,溫度傳感器,WDT 輸入/輸出數(shù):16 程序存儲(chǔ)器容量:8KB(4K x 16) 程序存儲(chǔ)器類型:閃存 EEPROM 大小:512 x 8 RAM 容量:512 x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 11x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:20-SOIC(0.295",7.50mm 寬) 包裝:帶卷 (TR)
TSC87251G2D-24CE 功能描述:IC C251 MCU OTPROM 32K 44VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:8x251 標(biāo)準(zhǔn)包裝:1,500 系列:AVR® ATtiny 核心處理器:AVR 芯體尺寸:8-位 速度:16MHz 連通性:I²C,LIN,SPI,UART/USART,USI 外圍設(shè)備:欠壓檢測(cè)/復(fù)位,POR,PWM,溫度傳感器,WDT 輸入/輸出數(shù):16 程序存儲(chǔ)器容量:8KB(4K x 16) 程序存儲(chǔ)器類型:閃存 EEPROM 大小:512 x 8 RAM 容量:512 x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 11x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:20-SOIC(0.295",7.50mm 寬) 包裝:帶卷 (TR)