參數(shù)資料
型號： TSG356-657CGYH
廠商： ADVANCED INTERCONNECTIONS CORP
元件分類： 插座
英文描述： BGA356, IC SOCKET
文件頁數(shù)： 2/3頁
文件大?。?/td> 120K
代理商： TSG356-657CGYH
5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com
REV. 8/01
Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown: inch/(mm).
Patented Pop-Top Action
Finned
Heat Sink
(3 Fins Std.
Consult
Factory
for Options)
Solder
Joint
Solder Ball
.050
(1.27)
BGA
Adapter
Socket
Pop-Top BGA
Socket Adapter System
Pop-Top System Features
Designed for large I/O BGA devices.
Patented limited-stroke terminal
design allows ultra low insertion and
extraction.
AIC patented eutectic solder ball
terminals offer superior processing.
Compact design maximizes PCB real
estate – only 0.139/(3.52mm) nomi-
nal wider than BGA device body size
on clip side.
Uses same footprint as BGA device.
Currently available in .050/(1.27mm)
pitch.
Available with integral, finned heat
sink or coin screw.
Specifications
Terminals: Brass; Copper Alloy
(C36000), ASTM-B-16
Contacts: Beryllium Copper; Copper
Alloy (C17200), ASTM-B-194
Plating
: G – Gold over Nickel
Body Material:
Molded PPS (High Temp. Glass Filled
Thermoplastic), U.L. Rated 94V-O,
-60
°C to 260°C (-76°F to 500°F)
Solder Ball:
Eutectic, 63Sn/37Pb, 183
°C (361.4°F)
How It Works
Step 1
Solder BGA Socket to PCB.
Step 2
Solder BGA device to
Adapter.
Step 3
Align and insert device/
Adapter assembly into BGA
Socket.
Step 4
Slide Retention Clamp over
entire assembly.
Turn Coin Screw (CS) or
Number of Positions
*See BGA Footprint Booklet or web site
X PTS XXXX - 636 G
G
HS
Terminal Plating
G - Gold
Contact Plating
G - Gold
Clamp Options
HS - Heat Sink (3 Fins Std.)
CS - Coin Screw
QH - Heat Sink w/ Support Plate
QS - Coin Screw w/ Support Plate
1.27mm Pitch Terminal Type
Footprint Dash #
If Applicable*
Model Type
PTS = Pop-Top w/ Short Slide clamp
NEW Short Slide Clamp
Retention Clamp Sliding
For High Density PC Boards
Direction For Pop-Top
(Also Standard On True BGA Socket)
and True BGA Socket
Reduces required installation
space (clearance for sliding
clamp) by 50 to 75%
How To Order
2. After travel & lock down with
screw or heat sink to point B
B
1. "Zero" Insertion
to point A
A
Travel
Finned Heat Sink (HS) to engage Adapter into Socket and lock down
ADVANCED
Pin 1 indicator always
shown in lower left
corner on Advanced
footprint drawings.*
Retention Clamp
slides to mechanical
stop on socket.
SLIDE ON
SLIDE OFF
*Refer to BGA Footprints Booklet
or AIC Web Site for drawings
ADVANCED
Clearance needed approx.
33% of device package size
on one side only
Mechanical specifications for BGA device package required for quoting/ordering.
4
相關(guān)PDF資料
PDF描述
TSG356-659CGYH BGA356, IC SOCKET
TSG356-708CGYC BGA356, IC SOCKET
TSG356-708CGYH BGA356, IC SOCKET
TSG356-709CGYC BGA356, IC SOCKET
TSG356-709CGYH BGA356, IC SOCKET
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